A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates

Bhuiyan, Emran Hossain; Behroozfar, Ali; Daryadel, Soheil; Moreno, Salvador; Morsali, S.R.; Minary‐Jolandan, Majid

doi:10.1038/s41598-019-55640-7

Cited by 34 publications

(25 citation statements)

References 38 publications

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“…Conductive inks function as the core part of the electronic device, which triggers an extensive amount of conductive ink formulations for developing highly stable and conductive patterns on the desired flexible substrate. A variety of conductive inks (Table ) have been reported, such as metal nanoparticles, − liquid metal, − graphene inks, − metal precursor inks, − carbon nanotube-based inks, − and conductive polymer inks. − In this context, the conductive metal inks, including Ag, − Cu, − Au, − and Ni, − have successfully managed to attain high electric conductivity. The emerging liquid metal has both metallic and fluidic properties, including gallium–indium (Ga–In) alloy (such as GaIn 24.5 , Ga 62.5 In 21.5 Sn 16 ) and bismuth-based alloy (such as Bi 32.5 In 51 Sn 16.5 ).…”

Section: Introductionmentioning

confidence: 99%

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Chang

Khuje

et al. 2021

ACS Nano

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Printed copper materials have been attracting significant attention prominently due to their electric, mechanical, and thermal properties. The emerging copper-based flexible electronics and energy-critical applications rely on the control of electric conductivity, current-carrying capacity, and reliability of copper nanostructures and their printable ink materials. In this review, we describe the growth of copper nanostructures as the building blocks for printable ink materials on which a variety of conductive features can be additively manufactured to achieve high electric conductivity and stability. Accordingly, the copper-based flexible hybrid electronics and energy-critical devices printed by different printing techniques are reviewed for emerging applications.

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Section: Introductionmentioning

confidence: 99%

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Chang

Khuje

et al. 2021

ACS Nano

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“…Recently, an alternative nozzle-based electrodeposition method was also used to prepare metallic conductive patterns under room environment without the sintering process. Minary-Jolandan et al 33 printed Cu and Ni nanocrystals on flexible substrates by employing a hybrid electrodeposition process without sintering process or thermal annealing. However, this process required to etch the deposition layer after the printing process.…”

Section: ■ Introductionmentioning

confidence: 99%

Electroless Plating Cycle Process for High-Conductivity Flexible Printed Circuits

Zhang

Shi

et al. 2021

ACS Sustainable Chem. Eng.

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In this work, a non-formaldehyde electroless plating cycle process was successfully applied to prepare the flexible copper printed circuits on poly (ethylene terephtalate) (PET) films.Copper nanoparticles (Cu NPs) were employed as catalytic seeds, and dimethylaminoborane (DMAB) was used as the reductant. Cu NPs were directly printed on the PET surface modified by 3mercaptopropyltriethoxysilane (MPTES) to serve as the seeds to trigger the electroless deposition. MPTES modification can dramatically improve the adhesion of the PET and Cu layer. Cu NPs can ideally substitute noble metals Ag, Pt, and Pd to catalyze electroless deposition. DMAB, as an innocuous reductant can replace formaldehyde in an alkalescent plating bath. The amount of Cu NPs with different sizes on the per area of the PET surface was investigated to determine its appropriate dosage. Various times, temperatures, concentrations of reactants in the electroless plating process were researched to obtain optimal deposition. The minimal sheet resistance of the copper pattern was 6 mΩ/sq with a resistivity of 2.01 μΩ•cm, which is 1.18 times that of bulk copper. These results demonstrated that the prepared Cu pattern had excellent conductivity. The kinetics of the electroless plating process was researched to quantify the thickness of the Cu layer and the consumption of reactants. The electroless plating bath can well be cycled after compensating reactants, while the sheet resistance of the Cu pattern fluctuated very little. The cycling electroless plating bath will greatly reduce the discharge of waste and is of vital significance for the large-scale and cheap manufacturing of flexible printed electronics.

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“…Seol et al presented a 3D printing method that can control the ambient relative humidity and voltage to control the electrodeposition of metal microstructures and fabricate complex metal microstructures [14]. Bhuiyan et al demonstrated interconnect fabrication by electroless plating on 3D printed electroplated patterns and implemented a hybrid process for printing pure and high conductivity nanocrystalline copper and nickel on flexible polymeric substrates [15,16].…”

Section: Introductionmentioning

confidence: 99%

Study of Microscale Meniscus Confined Electrodeposition Based on COMSOL

Zhang

Rong

et al. 2021

Micromachines

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The rate and quality of microscale meniscus confined electrodeposition represent the key to micromanipulation based on electrochemistry and are extremely susceptible to the ambient relative humidity, electrolyte concentration, and applied voltage. To solve this problem, based on a neural network and genetic algorithm approach, this paper optimizes the process parameters of the microscale meniscus confined electrodeposition to achieve high-efficiency and -quality deposition. First, with the COMSOL Multiphysics, the influence factors of electrodeposition were analyzed and the range of high efficiency and quality electrodeposition parameters were discovered. Second, based on the back propagation (BP) neural network, the relationships between influence factors and the rate of microscale meniscus confined electrodeposition were established. Then, in order to achieve effective electrodeposition, the determined electrodeposition rate of 5 × 10−8 m/s was set as the target value, and the genetic algorithm was used to optimize each parameter. Finally, based on the optimization parameters obtained, we proceeded with simulations and experiments. The results indicate that the deposition rate maximum error is only 2.0% in experiments. The feasibility and accuracy of the method proposed in this paper were verified.

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A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates

Cited by 34 publications

References 38 publications

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics

Electroless Plating Cycle Process for High-Conductivity Flexible Printed Circuits

Study of Microscale Meniscus Confined Electrodeposition Based on COMSOL

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