A hybrid vapor chamber heat sink incorporating a vapor chamber and liquid cooling channel with outstanding thermal performance and hydraulic characteristics

Wang, Huawei; Bai, Peng; Cai, Ruipeng; Luo, Yi; Chen, Xingliang; Wu, Guozhong; Tang, Yifan; Zhou, Guofu

doi:10.1016/j.enconman.2021.114499

Cited by 23 publications

(4 citation statements)

References 40 publications

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“…Deionized water is injected into the plate through the charging tube, and the air inside the plate is evacuated using a vacuum pump for 400 seconds. Finally, the pressure sensor shows a pressure of 7 × 10 -4 Torr at the sealing interface 43 . The injection tube is clamped flatly using a clamping die to seal the tube.…”

Section: Methodsmentioning

confidence: 99%

“…The typical passive embedded cooling packages contain the vapor chamber (VC, a passive phase change heat transfer device) [25][26][27] . Associated with the wick structures, the evaporation/condensation circulation in the VC can rapidly remove the heat flux from hotspots and achieve hightemperature uniformity on the hotspot surfaces 28,29 . Without any external auxiliary power, the passive embedded phase change cooling architecture can be compatibly fabricated in the compact packages of power devices.…”

Section: Introductionmentioning

confidence: 99%

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Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

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Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

“…The uncertainties of sample length, capillary rise height, and capillary rise velocity were estimated to be 1, 0.9, and 3.5%, respectively. The uncertainty of the capillary rise experiment can be evaluated by the standard uncertainty analysis method of eq e ( f ) f = ∑ i = 0 n ( ∂ f ∂ X i e X i ) 2 f where e ( f ) is the measurement error of the variable f , and e X i is the maximum error of each part defined as X i . The uncertainty of the capillary parameter Δ P c · K can be calculated as 5.35% by the above equation.…”

Section: Experimental Sectionmentioning

confidence: 99%

Section: Theory and Data Analysismentioning

confidence: 99%

High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

Yuan,

Yan,

Huang

et al. 2024

Langmuir

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Directly integrating ceramic vapor chambers into the insulating substrate of semiconductor power devices is an effective approach to solve the problem of heat dissipation. Microgrooves that could be machined directly on the shell plate without contact thermal resistance and mechanical dislocation offer exciting opportunities to achieve high-performance ceramic vapor chambers. In this study, a bioinspired hierarchical microgroove wick (BHMW) containing low ribs via one-step nanosecond pulsed laser processing was developed, as inspired by the Sarracenia trichome. The superwicking behavior of microgrooves with different structural parameters was investigated using capillary rise tests and droplet-spreading experiments. The BHMW exhibited excellent capillary performance and anisotropic hemiwicking performance. At a laser scanning spacing of 30 μm, the BHMW achieved a capillary wicking height of 114 mm within 20 s. The optimized BHMW demonstrated a capillary parameter (ΔP c •K) and an anisotropic hemiwicking ratio of 4.46 × 10 −7 N and 11.93, respectively, which were 1182 and 946% higher than references, as achieved through nanosecond pulsed laser texturing under identical parameters. This work not only develops a high-performance hierarchical alumina microgroove wick structure but also outlines design guidelines for high-performance ceramic vapor chambers for thermal management in semiconductor power devices.

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Heat Transfer Performance of Copper Foam-Based Vapor Chamber Composite Liquid Cooling System Under Double-Sided Heating

Zhao,

Chen,

et al. 2024

Int J Thermophys

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A hybrid vapor chamber heat sink incorporating a vapor chamber and liquid cooling channel with outstanding thermal performance and hydraulic characteristics

Cited by 23 publications

References 40 publications

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

High-Performance Bioinspired Hierarchical Microgroove Wick for Ceramic Vapor Chambers Achieved by Nanosecond Pulsed Lasers

Heat Transfer Performance of Copper Foam-Based Vapor Chamber Composite Liquid Cooling System Under Double-Sided Heating

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