A junction temperature model based on heat flow distribution in an IGBT module with solder layer voids

Li, Qi; Zhang, Feng; Chen, Yonghe; Fu, Tao; Zheng, Zhanheng

doi:10.1016/j.heliyon.2024.e33625

Heliyon

2024

DOI: 10.1016/j.heliyon.2024.e33625

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A junction temperature model based on heat flow distribution in an IGBT module with solder layer voids

Qi Li,

Feng Zhang,

Yonghe Chen

et al.

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A junction temperature model based on heat flow distribution in an IGBT module with solder layer voids

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References 28 publications

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