Epoxy resins coming from biobased
bisphenols have received
significant
attention; however, thymol-derived bisphenol epoxies are still essentially
unknown so far. Here, a biobased bisphenol E (DHPF) intermediate was
obtained from thymol and acetaldehyde via a highly efficient approach,
followed by O-glycidylation to afford a bisphenol E epoxy monomer
(DHEP) with a viscosity of only 3.5 Pa·s at 60 °C identical
to that of a bisphenol A epoxy (DGEBA). Using 4,4′-diaminodiphenyl
sulfone (44DDS) and methyltetrahydrophthalic anhydride (MTHPA) as
curatives, cured DHEP thermosets were prepared through cast molding,
and their properties are systematically studied and compared with
DGEBA thermosets. DHEP delivers a lower dielectric constant to the
resulting thermosets, especially for DHEP/MTHPA (1.9, 10 MHz). The
DHEP-based thermoset also exhibits decreased water absorption, density,
and thermal diffusivity and improved resistance to hygrothermal aging
as indicated by storage modulus and T
g retention, and good bulk mechanical properties. Moreover, when formulated
into an epoxy adhesive for bonding stainless steel sheets, DHEP endows
the glue joint with a rather high lap shear strength up to 12.7 MPa.
Overall, DHPF can be readily prepared in large quantities, and DHEP
is potentially 100% biobased with good processability; the finalized
DHEP thermosets have advantages in many properties of high interest,
thereby illustrating its good prospects for real applications.