A large scale Titanium Thermal Ground Plane

Sigurdson, Marin; Liu, Yuwei; Bozorgi, Payam; Bothman, David P.; MacDonald, N.C.; Meinhart, Carl

doi:10.1016/j.ijheatmasstransfer.2013.01.064

Cited by 33 publications

(13 citation statements)

References 15 publications

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“…Researchers at the University of California Santa Barbara explored fabrication of all-titanium vapor chambers [189,190]. Relative to other potential materials, titanium offers excellent corrosion resistance, light weight, high fracture toughness, and can be used as the substrate for microfabrication of high-aspect-ratio wick features [191].…”

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

“…A large-scale titanium thermal ground plane (300 mm × 76 mm × 4.5 mm) with 24 individual heat source mounting locations was later fabricated using the same fabrication techniques [190]. Unlike the small-scale Ti-TGP, which used an array of microfabricated pillars, the large-scale device consisted of a groove wick with nanostructured titania.…”

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

“…The groove structure was optimized to maximize the heat transport capability (by equating the capillary pressure with pressure losses) and for a device in a vertical reflux orientation. Effective device thermal conductivities of 5000-8000 W/mK were measured based on the effective working length during simulated testing of the large-scale Ti-TGP using 8 independent heat sources; total heat dissipation was 500 W and 1000 W at evaporator temperatures of 100 °C and 150 °C, respectively [190].…”

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

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Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

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Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

Section: Titanium Thermal Ground Plane (Ti-tgp)mentioning

confidence: 99%

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Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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“…Both are hermetically sealed and partially filled with a liquid such as refrigerant, water, etc. A traditional vapor chamber consists of a hollow cavity with sintered particles around its periphery and a relatively small volume fraction of liquid [15][16][17]. A FP-OHP is unique in that it does not rely on a wicking structure to return condensate to the evaporator [18][19][20][21][22][23].…”

Section: The Flat-plate Oscillating Heat Pipementioning

confidence: 99%

“…The traditional material of interest for any heat pipe (or TGP) has been copper due to its inherently high thermal conductivity; however, various other materials have been recently investigated, including aluminum [35,[37][38][39][40], titanium [16,41], copper molybdenum (CuMo) [42], polymers [43] and silicon [44]. Material selection for any TGP, and specifically FP-OHPs, is limited by the material's machinability and ability to be metallurgically bonded to like or dissimilar materials -i.e.…”

Section: Materials Selectionmentioning

confidence: 99%

Additive manufacturing of heat exchangers: A case study on a multi-layered Ti–6Al–4V oscillating heat pipe

Thompson

Aspin

Shamsaei

et al. 2015

Additive Manufacturing

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Passive Ultra‐Conductive Thermal Metamaterials

Guo

Tian

et al. 2022

Advanced Materials

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Ultra‐conductive heat transport showcases significant potentials in popular thermal managements with convection, phase change, and heat source. However, it is captivated impossible for passive thermal manipulation, usually bounded by intrinsic thermal conductivities of natural materials, to outperform these active recipes in need of extra energy payload. Here, a robust recipe to create passive ultra‐conductive thermal metamaterials consisting of nothing but bulk natural materials is reported. Thanks to the local thermal resistance regulation by vertical thermal transport channel, the proof‐of‐concept thermal metamaterials experimentally demonstrate extreme effective conductivity (1915 W m–1 K–1) solely with naturally occurring materials. The purely conductive modulation without any external energy is comparable to active counterparts, and further reveals its robustness and unexpected convenience. The findings construct a high‐efficient paradigm of passive thermal management with ultra‐conductive heat transport, and further hint potentials in other Laplace fields, e.g., DC and magnetostatics.

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A large scale Titanium Thermal Ground Plane

Cited by 33 publications

References 15 publications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Additive manufacturing of heat exchangers: A case study on a multi-layered Ti–6Al–4V oscillating heat pipe

Passive Ultra‐Conductive Thermal Metamaterials

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