A laterally-driven micromachined inertial switch with a compliant cantilever beam as the stationary electrode for prolonging contact time

Abstract

A novel micro-electromechanical systems inertial switch based on non-silicon surface micromachining technology has been designed, fabricated and characterized in the present work. Compared with the traditional inertial switch, a compliant cantilever beam as a stationary electrode has been proposed to prolong the contact time, which can realize sufficient elastic deformation during the contact between the electrodes. The dynamic contact process is analyzed theoretically and the corresponding mechanical impact mechanism is also explained. To investigate the contact-enhancing mechanism of the cantilever beam, the switch applied half-sine acceleration with various amplitudes in the sensitive direction is simulated with ANSYS software. The dynamic simulation results confirm the contact-enhancing mechanism described by the theoretical analysis and it is shown that the contact time (i.e., the switch-on time) can be prolonged effectively by utilizing the elastic deformation of the cantilever beam and increased with the applied accelerations. The inertial switch is successfully fabricated by electroplating and sacrificial layer processes technologies. The prototype has been characterized by dropping hammer experiment. The test results indicate that the contact effect is improved significantly and the contact time is ∼80 µs under the 297 g acceleration, and the maximum value is ∼410 µs for the 672 g acceleration amplitude, which is in general accordance with the simulated results. The mechanical contact between the cantilever beam and the proof mass is evaluated following thousands of impacts. The scanning electron micrographs of the contact surfaces indicate that the all-metal switch still keeps a good mechanical property after suffering the hot contact, and the contact resistance is also stable.

A Low-G Silicon Inertial Micro-Switch with Enhanced Contact Effect Using Squeeze-Film Damping

“…In recent years, in order to enhance the contact effect of the intermittent switch, there has been considerable effort put into the inertial micro-switch with a flexible electrode fabricated by the multi-layer process of electroplating technology [ 14 , 17 , 18 , 19 ]. The contact effect can be improved by the deformation of the flexible electrode during the contact process.…”

A 5 g Inertial Micro-Switch with Enhanced Threshold Accuracy Using Squeeze-Film Damping

“…This kind of switch is usually fabricated by a multi-layer nickel-electroplating process, based on the surface micromachining technology, since the conventional bulk silicon micromachining technology mainly results in rigid structures. However, the often-repeated electroplating processes might cause unexpected fabrication errors such as dimension variations, an inhomogeneous Young’s modulus, and structural deformation induced by residual stresses between each electroplating layer, leading to a threshold deviation from the designed value [ 4 , 13 , 14 , 15 , 16 , 17 ], as shown in Table 1 . In Ref.…”

Design, simulation and characterization of a MEMS inertia switch with flexible CNTs/Cu composite array layer between electrodes for prolonging contact time

“…However, many rigid contacts between the fixed and movable electrode always led to short contact times (less than 5 μs) and bouncing phenomenon, which severely decrease the property of the switch and is an obstacle for the subsequent circuit signal process in many applications [3]. In order to prolong the contact time, some kinds of inertia switches with compliant structures have been proposed and fabricated to reduce the stiffness of the fixed electrode in the previous work [4][5][6][7]. However, the limited effort only improves the contact effect to some extent (about tens of microseconds).…”