2011
DOI: 10.1109/tap.2010.2090473
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A Lightweight Organic X-Band Active Receiving Phased Array With Integrated SiGe Amplifiers and Phase Shifters

Abstract: This paper presents for the first time an X-band antenna array with integrated silicon germanium low noise amplifiers (LNA) and 3-bit phase shifters (PS). LNAs and PSs were successfully integrated onto an 8 2 lightweight antenna utilizing a multilayer liquid crystal polymer (LCP) feed substrate laminated with a duroid antenna layer. A baseline passive 8 2 antenna is measured along with a SiGe integrated 8 2 receive antenna for comparison of results. The active antenna array weighs only 3.5 ounces and consumes … Show more

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Cited by 32 publications
(17 citation statements)
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“…These active devices will be wire-bonded to the bottom layer of the MLO substrate. Figure 10 shows the measured return loss obtained from a fabricated 8x2 array with integrated LNAs and phase-shifters [1]. Similar performance is expected from the fabricated 8x8 array with Wilkinson dividers.…”
Section: Microstrip Antenna Arrayssupporting
confidence: 56%
See 2 more Smart Citations
“…These active devices will be wire-bonded to the bottom layer of the MLO substrate. Figure 10 shows the measured return loss obtained from a fabricated 8x2 array with integrated LNAs and phase-shifters [1]. Similar performance is expected from the fabricated 8x8 array with Wilkinson dividers.…”
Section: Microstrip Antenna Arrayssupporting
confidence: 56%
“…Two 1-mil thick bond ply layers were used to complete the multilayer stackup. The RF distribution network was built on an embedded layer to allow room for integrated SiGe active devices such as LNAs, and phase-shifters on the bottom layer [1]. The antenna arrays were designed at a center frequency of 9.5 GHz with a bandwidth of 500 MHz.…”
Section: Microstrip Antenna Arraysmentioning
confidence: 99%
See 1 more Smart Citation
“…In these implementations, a PS and an LNA within a single SiGe IC are used to drive individual [6] or several [7], [8] radiating elements in the array. The true benefit of these designs relies on the reduction of the NF of the system as it is significantly improved by placing the active circuitry closer to the radiating elements.…”
Section: Introductionmentioning
confidence: 99%
“…Further reductions in weight and footprint size have been achieved through vertical stack-ups of organic substrates such as liquid crystal polymer (LCP) and duroid [7]- [9]. Additionally, vertical stack-ups of organic materials give physical flexibility which permits the conformal mounting of the arrays without having to trade off future scalability of the system to a higher number of radiating elements.…”
Section: Introductionmentioning
confidence: 99%