A liquid cooling solution for temperature redistribution in 3D IC architectures

Kearney, Daniel; Hilt, Thierry; Pham, Pascale

doi:10.1016/j.mejo.2011.03.012

Cited by 18 publications

(5 citation statements)

References 24 publications

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“…Similarly, 3D-ICs architectures stack multiple dies, interconnected through vertical connectors to extend the performance of 2D chips [9]. Here, thermal management becomes critical as the heat-generating layers are aligned in adjacent films creating localized hotspots, and any dissimilarity between power maps of individual chips constituting the stack would add another geometrical dimension to the thermal non-uniformity [21,22].…”

Section: Introductionmentioning

confidence: 99%

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Vilarrubí

2024

Heat Transfer - Advances in Fundamentals and Applications

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Thermal management is today a primary focus in the electronics industry due to the continuous increase of power density in chips increasingly smaller in size, which has become a critical issue in fast-growing industries such as data centers. As air-cooling fails to meet the high heat extraction demands of this sector, liquid cooling emerges as a promising alternative. Nevertheless, advanced microelectronic components require a cooling system that not only reduces the energetic consumption but also enhances the thermal performance by minimizing the thermal resistance and ensuring high-temperature uniformities, especially under variable heat load scenarios with high heat dissipating hotspot regions, where conventional liquid cooling solutions prove inefficient. This chapter provides an overview of different passive heat transfer enhancement techniques of micro heat sinks from the literature, focusing on intelligent and adaptive solutions designed to optimize the cooling performance based on local and instantaneous cooling requirements for non-uniform and time-dependent power distribution maps.

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Section: Introductionmentioning

confidence: 99%

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Vilarrubí

2024

Heat Transfer - Advances in Fundamentals and Applications

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“…The micro-channel cooling technology, emerging as a powerful tool to remove the excessive heat in the 3-D chips, has received considerable attention [11][12][13][14][15][16][17][18][19]. Micro-channels are embedded in the interlayer regions of the 3D-IC, where the coolant is pumped through the micro-channels and removes the heat inside 3D-IC by thermal conduction and convection.…”

Section: Introductionmentioning

confidence: 99%

Thermal management of the hotspots in 3-D integrated circuits

Wang

Sun

et al. 2018

THERM SCI

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Vertical integration for microelectronics possesses significant challenges due to its fast dissipation of heat generated in multiple device planes. This paper focuses on thermal management of a 3-D integrated circuit, and micro-channel cooling is adopted to deal with the 3-D integrated circuitthermal problems. In addition, thermal through-silicon vias are also used to improve the capacity of heat transmission. It is found that combination of microchannel cooling and thermal through-silicon vias can remarkably alleviate the hotspots. The results presented in this paper are expected to aid in the development of thermal design guidelines for 3-D integrated circuits.

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“…Even so, the demand for a direct liquid cooling method is increasing continuously as one of the key future thermal methods because of the high heat removal rate that is possible. So far, most liquid cooling studies have been indirect liquid cooling systems integrating a microchannel in a heat sink or a heat pipe (Shi et al 2012;Kearney et al 2012;Biswal et al 2009;Zhang et al 2037;Alam et al 2012). For more practical use, liquid heat sinks have to resolve several thermal challenges, including the low thermal conductivity of TIM, the high interface thermal resistance between a heat sink and a package, the uneven thermal conductivity path, and the difficulty of assembling a process for a liquid heat sink on a chip.…”

Section: Introductionmentioning

confidence: 99%