A liquid-filled microrelay with a moving mercury microdrop

Simon, J.; Saffer, S.; Kim, Chang‐Jin

doi:10.1109/84.623109

Cited by 71 publications

(28 citation statements)

References 12 publications

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“…Electrical energybased pumps only transport electrically conductive liquid [1]. The electrowetting and electrowetting on dielectric technique [2,3] has been applied to drive liquid droplets by electrically changing the wettability of liquids on solid surfaces.…”

Section: Thermocapillay Pumpingmentioning

confidence: 99%

Recent Studies on Fluid Flow and Heat Transfer in Thermal Microdevices

Yoo

2006

Nanoscale and Microscale Thermophysical Engineering

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Control and measurement of fluid flow and heat transfer in microdevices is of great importance to the development and application of MEMS and Bio-MEMS such as thermal inkjet printer heads, microchemical reactors, and PCR. Thus, the detailed flow behavior, in particular the two-phase flow in microdevices, has attracted much attention in recent years. Several types of thermal micropumps have been developed, although there is still room for further development. Various techniques for measuring the temperature, which are applicable to microscale devices, have also been proposed. As the cooling problem in microdevices becomes increasingly significant, a prospective view on integrated heat and mass transfer is quite necessary. Thus, in this work, some issues and future prospects for fluid dynamics and heat transfer of thermal microdevices are presented and discussed, in terms of thermocapillary pump, temperature measurement in microdevices, and flow near an evaporating meniscus.

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Section: Thermocapillay Pumpingmentioning

confidence: 99%

Recent Studies on Fluid Flow and Heat Transfer in Thermal Microdevices

Yoo

2006

Nanoscale and Microscale Thermophysical Engineering

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“…Operation of the relay has been first demonstrated using temporary sealing with a glass cover pressing on the wafer in [2]. however, the device tended to leak, and a more reliable and permanent sealing method was eventually obtained when wicking channels were added [3]. The first MEMS device that employs the so-called "continuous electrowetting" phenomenon has been realized as a liquid micromotor by the microgasketing process [4].…”

Section: Example 1: Microrelay Fabricationmentioning

confidence: 99%

Microgasketing and adhesive wicking techniques for fabrication of microfluidic devices

Kim

1998

SPIE Proceedings

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Microgasketing procedure, developed for MEMS fluidic device fabrication, is described. Planarprocessed microdevices of a volume even less than 1 ni can be selectively filled with liquid and sealed at room temperature in a batch fashion. Isolating a liquid within such a small device area by the gasketing and minimizing air traps during sealing by controlled wicking are the key issues addressed. Two unique microdevices made possible by the described technique are presented: 1) a microrelay switched by a liquidmetal droplet (10 im in diameter), and 2) a highly efficient (e.g., power consumption < 10 iW with driving potential < 10 V) liquid micromotor driven by surface tension force.

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“…Here, we show that it is possible to harness this surface oxide to enable a new method for creating droplets that are soft and have metallic electrical, optical and thermal properties. The ability to fabricate liquid metal droplets with a controlled geometry is important for energy harvesting [19], self-healing composites [8], soft electrodes [20], micropumps [21,22], interconnects [23], liquid marbles [24], switches [25] and relays [26]. Molten metal droplets are also used routinely as solder bumps for flip chips [27,28].…”

Section: Introductionmentioning

confidence: 99%

Production of Liquid Metal Spheres by Molding

Mohammed

Xenakis

Dickey

2014

Metals

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This paper demonstrates a molding technique for producing spheres composed of eutectic gallium-indium (EGaIn) with diameters ranging from hundreds of microns to a couple millimeters. The technique starts by spreading EGaIn across an elastomeric sheet featuring cylindrical reservoirs defined by replica molding. The metal flows into these features during spreading. The spontaneous formation of a thin oxide layer on the liquid metal keeps the metal flush inside these reservoirs. Subsequent exposure to acid removes the oxide and causes the metal to bead up into a sphere with a size dictated by the volume of the reservoirs. This technique allows for the production and patterning of droplets with a wide range of volumes, from tens of nanoliters up to a few microliters. EGaIn spheres can be embedded or encased subsequently in polymer matrices using this technique. These spheres may be useful as solder bumps, electrodes, thermal contacts or components in microfluidic devices (valves, switches, pumps). The ease of parallel-processing and the ability to control the location of the droplets during their formation distinguishes this technique.

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A liquid-filled microrelay with a moving mercury microdrop

Cited by 71 publications

References 12 publications

Recent Studies on Fluid Flow and Heat Transfer in Thermal Microdevices

Recent Studies on Fluid Flow and Heat Transfer in Thermal Microdevices

Microgasketing and adhesive wicking techniques for fabrication of microfluidic devices

Production of Liquid Metal Spheres by Molding

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