A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics

Dong, Yue; Lin, Zhisheng; Li, Xiaodong; Zhu, Qi; Li, Ji‐Guang; Sun, Xudong

doi:10.1039/c8tc01849a

Cited by 39 publications

(39 citation statements)

References 41 publications

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“…Dong et al were able to use their Cuf complexed with 1,2-diaminepropane ink to obtain films with 1 = 1.80 10 À7 W m on PI when heated at 180 8C for 1 min when sintering in air. [83] More recently, Yabuki et al studied the decomposition profiles of inks synthesised by complexing Cuf with various low BP amines (butylamine, pentylamine and octylamine). [84] They deposited conductive Cu films on glass by sintering the inks near their onset temperatures for decomposition, with the Cufpentylamine ink performing best.…”

Section: Copper Mod Inksmentioning

confidence: 99%

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MODs vs. NPs: Vying for the Future of Printed Electronics

Douglas

Mrig

Knapp

2021

Chemistry A European J

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This Minireview compares two distinct ink types, namely metal-organic decomposition (MOD) and nanoparticle (NP) formulations, for use in the printing of some of the most conductive elements: silver, copper and aluminium. Printing of highly conductive features has found purpose across a broad array of electronics and as processing times and temperatures reduce, the avenues of application expand to low-cost flexible substrates, materials for wearable devices and beyond. Printing techniques such as screen, aerosol jet and inkjet printing are scalable, solutionbased processes that historically have employed NP formula-tions to achieve low resistivity coatings printed at high resolution. Since the turn of the century, the rise in MOD inks has vastly extended the range of potentially applicable compounds that can be printed, whilst simultaneously addressing shelf life and sintering issues. A brief introduction to the field and requirements of an ink will be presented followed by a detailed discussion of a wide array of synthetic routes to both MOD and NP inks. Unindustrialized materials will be discussed, with the challenges and outlook considered for the market leaders: silver and copper, in comparison with the emerging field of aluminium inks.

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Section: Copper Mod Inksmentioning

confidence: 99%

“…Dong et al. were able to use their Cuf complexed with 1,2‐diaminepropane ink to obtain films with ρ= 1.80×10 −7 Ω m on PI when heated at 180 °C for 1 min when sintering in air [83] …”

Section: Recent Developments In Metal Inksmentioning

confidence: 99%

MODs vs. NPs: Vying for the Future of Printed Electronics

Douglas

Mrig

Knapp

2021

Chemistry A European J

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“…The peaks at 111 and 186 °C correspond to the desorption of physically adsorbed water and dehydroxylation of the brucite layers, respectively 51 . The exothermic peak at 391 °C is likely associated with oxidation of the metal Cu particles 52 that remained after the activity test. The peak at 294 °C can be caused by oxidation of carbonaceous deposits, which are highly reactive and easily oxidized on the catalyst surface 42,53 .…”

Section: Resultsmentioning

confidence: 99%

Cu‐Al mixed oxide derived from layered double hydroxide as an efficient catalyst for continuous‐flow reductive amination of aromatic aldehydes

Nuzhdin

Bukhtiyarova

2020

J of Chemical Tech & Biotech

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BACKGROUND: Secondary amines are important intermediates in the manufacture of pharmaceuticals and other valuable chemicals. Hence, there is a continuing interest in cost-effective and environmentally friendly methods for producing these compounds. Reductive amination of aldehydes or ketones with primary amines over heterogeneous metal catalysts is an attractive approach due to the use of inexpensive and environmentally benign molecular hydrogen as a reducing agent. RESULTS: Various secondary amines were obtained by two-step reductive amination of benzaldehyde derivatives and furfural with primary amines. The condensation of aromatic aldehydes with amines at room temperature in low water methanol gives imines, which are then hydrogenated in a flow reactor over CuAlO x catalyst derived from layered double hydroxide. This process does not require isolation and purification of intermediate imines and can be utilized to obtain several secondary amines in good to excellent yield. The time-dependent study showed that CuAlO x catalyst demonstrates excellent stability in imine hydrogenation. CONCLUSION: An environmentally friendly procedure has been developed for the synthesis of secondary amines through a reductive amination of aromatic aldehydes with primary amines over Cu-based catalyst. This procedure presents a novel way for the sustainable production of secondary amines.

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“…The free-particle nature of MOD inks, makes them especially interesting for inkjet printing, being possible to use ultra-fine nozzles without clogging problems [60,61]. In this case, technology is called reactive inkjet printing (RIP) [62].…”

Section: Stabilization Of Solid Mpmentioning

confidence: 99%

Chemistry of solid metal-based inks and pastes for printed electronics – A review

Cano‐Raya

Denchev

Cruz

et al. 2019

Applied Materials Today

115

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Printed electronics, PE, is one of the fastest growing technologies in the world; it allows the construction of electronic devices in low-cost flexible substrates by printing techniques (e.g., screen, gravure, offset, flexography and inkjet printing) traditionally used in several industries (e.g., graphics arts, textiles, polymers). In PE, ink pigments are replaced by metallic particles or precursors that impart the electrical conductivity to the resultant printed patterns. This work reviews the available solid metal formulations used for conductive inks and pastes, focusing on both metallic particles and polymeric components. The influence and technical requirements of most commonly used printing techniques, along with the postprocessing treatments to reach the aim performance in the resultant inks has been addressed. Considering that PE is an emerging profitable field with novel applications in radio frequency identification (RFID) tags, thin-film transistors (TFT), light-emitting diodes (LED), transparent conductive electrodes (TCE) and organic solar cells (OSC), among others, it is crucial to know how printed formulations work and how they can be molded to fulfill the applications requirements. In this review, apart from metallic solid particles that has been widely reviewed in the past, the chemistry of polymer matrices has been focused in order to elucidate its important role in resultant inks performance. Novel outstanding formulations, such as reactive or metal-organic-decomposition (MOD) inks, have been presented.

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A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics

Abstract: A Cu–diamine formulated ink for obtaining flexible conductive Cu films in an air atmosphere at temperatures as low as 130 °C.

Cited by 39 publications

References 41 publications

MODs vs. NPs: Vying for the Future of Printed Electronics

MODs vs. NPs: Vying for the Future of Printed Electronics

Cu‐Al mixed oxide derived from layered double hydroxide as an efficient catalyst for continuous‐flow reductive amination of aromatic aldehydes

Chemistry of solid metal-based inks and pastes for printed electronics – A review

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