A Low-Voltage Broadband D-Band BPSK Modulator for a PMCW Radar Transmitter in 22 nm FDSOI

Engelmann, Andre; Probst, Florian; Hetterle, Philip; Weigel, Robert; Dietz, Marco

doi:10.23919/apmc55665.2022.9999812

Cited by 4 publications

(1 citation statement)

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“…In this context, the components detailed in this work have been tailored for a broadband, 140 GHz radar transceiver. While their application is versatile, the specific motivation behind their development centered on their integration with a 140 GHz phase-modulated continuous wave (PMCW) radar, designed to offer a 12.5 GHz baseband bandwidth, specifically for hand gesture recognition [2,3].…”

Section: Introductionmentioning

confidence: 99%

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar

Bekker,

Gramlich,

Valenziano

et al. 2024

Int. J. Microw. Wireless Technol.

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A system-in-package for a wideband digital radar, in D-band, requires broadband, high-gain antennas combined with broadband chip-to-package and package-to-printed circuit board (PCB) interconnects. This paper demonstrates a wideband, low-loss quasi-coaxial signal transition, and a novel electric split ring resonator (eSRR)-based antenna-in-package (AiP) with a modified reflector concept, for improved gain, in embedded wafer level ball grid array (eWLB) technology. A complete chip-to-package-to-PCB interconnect is also demonstrated by combining the quasi-coaxial transition with a chip-to-package interconnect. The quasi-coaxial signal transition has the largest impedance bandwidth among ball grid array-based quasi-coaxial signal transitions. For the modified reflector concept, a horn-shaped cavity is micromachined in the PCB substrate and remetallized with aerosol-jet printing, placing the reflector 0.25λ from the antenna. The antenna gain is improved with up to 5.3 dB. The AiP with the horn-shaped reflector is the single element with the highest gain, in eWLB technology, above 100 GHz.

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Section: Introductionmentioning

confidence: 99%