2018 IEEE Micro Electro Mechanical Systems (MEMS) 2018
DOI: 10.1109/memsys.2018.8346564
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A magnetic, micro-spring-suspended system for the safe electrical interconnection of neural implants

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“… Fabrication process to realize the connector modules by means of microsystems processes performed on the wafer front ( a – c , h ) and rear ( d – g ), followed by the separation of the individual parts ( i , j ). Adapted from [ 30 ]. …”
Section: Figurementioning
confidence: 99%
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“… Fabrication process to realize the connector modules by means of microsystems processes performed on the wafer front ( a – c , h ) and rear ( d – g ), followed by the separation of the individual parts ( i , j ). Adapted from [ 30 ]. …”
Section: Figurementioning
confidence: 99%
“… Fully assembled 32-channel Si test structure in the ( a ) separated and ( b ) connected state. Adapted from [ 30 ]. …”
Section: Figurementioning
confidence: 99%
See 2 more Smart Citations