A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing
Geng Li,
Shang Wang,
Jiayue Wen
et al.
Abstract:To meet the demand for higher performance and wearability, integrated circuits are developing towards having multilayered structures and greater flexibility. However, traditional circuit fabrication methods using etching and lamination processes are not compatible with flexible substrates. As a non-contact printing method in additive manufacturing, electrohydrodynamic printing possesses advantages such as environmental friendliness, sub-micron manufacturing, and the capability for flexible substrates. However,… Show more
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