A Method for Measuring Frictional Forces and Shaft Vibrations during Chemical Mechanical Polishing

Carter, Phillip W.; Werts, Tom

doi:10.1149/1.2386929

Cited by 10 publications

(7 citation statements)

References 22 publications

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“…17 The variation of the coefficient of friction with velocity at low polish pressures is shown in Figure 4. Generally the COF value in the hydrodynamic lubrication regime is expected to be below 0.1, 28 which agrees with our experimental results.…”

Section: Case 1: Hydrodynamic To Partial Lubrication (3 Psi Pressure)supporting

confidence: 91%

High Rate Chemical Mechanical Polishing of Boron-Doped Polycrystalline Silicon

Pirayesh¹,

Cadien²

2014

ECS J. Solid State Sci. Technol.

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In this paper, the effect of lubrication on the polish rate and the surface quality of highly boron-doped polysilicon is presented. The mechanical effects of polishing were studied by altering the CMP process and lubrication regime. It was shown that increasing the polish velocity and slurry flow rate does not always increase the polish rate and that the lubrication behavior plays a dominant role in this process. Increasing the mechanical forces and altering the lubrication regime to boundary and dry lubrication were the key factors which resulted in a maximum polish rate. The maximum polish rate for the boron-doped polysilicon with 3.4 mΩ.cm−1 resistivity was ∼0.75μ/min and achieved in the dry lubrication regime. The coefficient of friction (COF) was also studied and agreed with the polish rate values where the dry lubrication polishing showed highest COF following the Stribeck curve. Finally the surface quality of the polished wafers were studied by AFM and it was shown that the lubrication behavior and friction force had minor effect on the surface roughness and all the wafers were perfectly smooth after polishing (Rq∼2Å).

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Section: Case 1: Hydrodynamic To Partial Lubrication (3 Psi Pressure)supporting

confidence: 91%

High Rate Chemical Mechanical Polishing of Boron-Doped Polycrystalline Silicon

Pirayesh¹,

Cadien²

2014

ECS J. Solid State Sci. Technol.

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“…Such a correlation is consistent with Carter et al's work where a correlation between shaft vibration intensity and blanket silicon dioxide removal rate using a ceria-based slurry was reported. 26 In our case however, we think the main reason for the observed near-perfect Figure 7. Stribeck+ curves corresponding to silicon dioxide CMP using SIS: (left) for in-situ conditioning reported in Figure 5, (right) for ex-situ conditioning in Figure 6.…”

Section: Resultsmentioning

confidence: 48%

“…25 The vibration represents a coupling between the lateral and vertical displacement or tilt of the carrier head and the wafer surface. 26 Figure 3 shows the instantaneous COF (top) and frictional force (bottom) this time using ex-situ conditioning with PA. Every other parameter is kept exactly the same as those in Figure 2. In contrast, several discrete but periodically distributed COF clusters are observed where the total vibration time is much longer than the in-situ case.…”

Section: Resultsmentioning

confidence: 99%

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Effect of Conditioning and Slurry Application Method on Silicon Dioxide Removal Rates Using a Ceria-Based Chemical Mechanical Planarization Slurry

Han

Sampurno

Bahr

et al. 2017

ECS J. Solid State Sci. Technol.

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In this study, the silicon dioxide removal rate using a "reverse" ceria-based slurry was investigated under four different combinations of conditioning modes and slurry application methods. In a "reverse" slurry, addition of water acts to promote material removal. Overall, the process using ex-situ conditioning with the slurry injection system (SIS) resulted the highest removal rate, while the process using in-situ conditioning with the conventional point application (PA) generated lowest removal rate. This study is aimed to explain the differences in silicon dioxide removal rate based on the variations of the actual slurry dilution ratio on top of the pad associated with conditioning and slurry application methods. The frictional analysis and Stribeck+ curves were employed to elucidate the tribological characteristics. The results showed that the conditioning modes and the slurry application methods varied the extent of the polishing vibrations. The silicon dioxide removal rate was found to linearly correlate with the extent of COF fluctuation. This work also underscored the importance of optimum slurry flow dynamics and injection geometry for obtaining a more cost-effective and environmentally benign chemical mechanical planarization process.

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“…There are several methods to determine the coefficient of friction by measuring friction forces using load cell, piezoelectric sensor, tool dynamometer, and non-contact capacitive displacement sensor. [39][40][41][42][43] It is also possible to determine the coefficient of friction between the work and the tool surface by monitoring the variation in the current drawn by the motor driving the tool during polishing of the work surface. 44 As this method is much easier compared to other methods, this work considered the measurement of power drawn by the motor rotating the tool mould.…”

Section: Characterisation Of Ibap Toolmentioning

confidence: 99%

Mechanical and tribological properties of ice-bonded abrasive polishing tools

Rambabu

Babu

2017

Proceedings of the Institution of Mechanical Engineers, Part B:

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This article covers the efforts on characterising ice-bonded abrasive polishing tool in terms of the mechanical and tribological properties such as hardness, coefficient of friction, and wear rate. These studies were attempted on the tools prepared at different temperatures ranging from −10 °C to 0 °C with a view to identify the condition suitable to prepare ice-bonded abrasive polishing tool for effective polishing of Ti–6Al–4V alloy specimen. It also presents the methods adopted to determine various properties of ice-bonded abrasive polishing tool. Hardness was estimated from the measured penetration depth of cone shape indenter into the tool, coefficient of friction was determined from the change in power drawn by the motor rotating the tool mould, and wear behaviour of tool was assessed from the melting rate of the tool determined from the change in height of ice-bonded abrasive polishing tool at different stages of polishing. From the results of this study, it is clear that ice-bonded abrasive polishing tool prepared at −4 °C has possessed sufficient hardness, coefficient of friction, and reasonable wear rate suitable for polishing of Ti–6Al–4V specimens. This article also covers the details of low-temperature coolant supply unit developed to prepare the ice-bonded abrasive polishing tool at any desired temperature between 0 °C and −40 °C and thus to maintain it for a long time. Polishing studies with such ice-bonded abrasive polishing tool showed 72% improvement in finish after 90 min of polishing of Ti–6Al–4V specimen with tool, prepared at −4 °C.

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A Method for Measuring Frictional Forces and Shaft Vibrations during Chemical Mechanical Polishing

Cited by 10 publications

References 22 publications

High Rate Chemical Mechanical Polishing of Boron-Doped Polycrystalline Silicon

High Rate Chemical Mechanical Polishing of Boron-Doped Polycrystalline Silicon

Effect of Conditioning and Slurry Application Method on Silicon Dioxide Removal Rates Using a Ceria-Based Chemical Mechanical Planarization Slurry

Mechanical and tribological properties of ice-bonded abrasive polishing tools

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