A Method to Monitor IGBT Module Bond Wire Failure Using On-State Voltage Separation Strategy

Kong, Qingyi; Du, Mingxing; Ouyang, Ziwei; Wei, Kexin; Hurley, W.G.

doi:10.3390/en12091791

Cited by 6 publications

(8 citation statements)

References 31 publications

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“…Note that V ce,on depends on the temperature and current, which requires the measurement at the same working point and same temperature. To tackle this problem, [62] decomposes the voltage into three parts and gives the temperature and current dependent formula of each part. In this way, the degradation caused component can be estimated even the temperature or current varies.…”

Section: D: Multiplexer-based Methodsmentioning

confidence: 99%

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Ensuring a Reliable Operation of Two-Level IGBT-Based Power Converters: A Review of Monitoring and Fault-Tolerant Approaches

Liu

Yang

et al. 2020

IEEE Access

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Despite the emerging multi-phase and multi-level converters, two-level insulated gate bipolar transistor-based power converters are still widely used in industrial applications in nowadays. Thus, its reliability is of significant importance for ensuring industrial safety. In this paper, a review of the possibilities to ensure the reliable operation of these power converters is presented. The possible approaches are categorized into two groups: condition monitoring and fault-tolerant control. The former approach performs the monitoring methods of power converters, which enables the identification of device degradation to be realized. Accordingly, the mechanisms, indicators, and measuring methods of degradation are demonstrated in this paper to assist the design of condition-based maintenance. In contrast, the latter approach is a postfault one, where power converters remain the operation by activating the fault-tolerant units after faults are identified. For this approach, fault detection, fault isolation, and tolerant strategies are essential. Finally, the performance and cost-effectiveness of the two categories are discussed in this paper. INDEX TERMS Two-level power converter, reliability, condition Monitoring, fault tolerance, renewable energy application, insulated gate bipolar transistor.

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Section: D: Multiplexer-based Methodsmentioning

confidence: 99%

“…V ref 3 is set such that it exceeds the gate voltage supply V D while smaller than the gate voltage under FUL V ge,FUL . A possible value is given in (62). Hence, when the voltage drop across R 2 is higher than V ref 3 , the FUL can be detected.…”

Section: B Short-circuit Fault Detection Methodsmentioning

confidence: 99%

Ensuring a Reliable Operation of Two-Level IGBT-Based Power Converters: A Review of Monitoring and Fault-Tolerant Approaches

Liu

Yang

et al. 2020

IEEE Access

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“…When the IGBT module experiences thermal cycling, thermal induced stresses will be produced at both the solder joints within the system and at the interconnection between the silicon chip and the aluminium bond wire. These thermal-mechanical stresses experienced within the IGBT will be responsible for solder-joint fatigue [18] [19] and bond wire lift-off [20] [21], which are the two dominant failure mechanisms experienced within the IGBT module. Information on the number of cycles before either of these failure mechanisms are triggered can be found based on physics of failure model and SCADA data, and as such plays an important role in optimizing the O&M strategy for the power converter of the offshore wind turbine.…”

Section: State-of-the-art Review Summarymentioning

confidence: 99%

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Simpson

Egea‐Àlvarez

Collu

2020

2020 9th International Conference on Renewable Energy Research and Application (ICRERA)

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Offshore wind energy is currently the leading offshore renewable energy technology and plays an essential role in achieving a low carbon economy in Europe. Offshore wind turbines, as a result of the harsher offshore environment, suffer from high O&M costs, and as such a high overall LCOE. These higher O&M costs can be reduced by focusing on the most critical subassemblies of the OWT, by either improving the reliability of the subassembly or by better understanding the failure mechanism, and thus optimizing the O&M strategy. The power converter is identified as one of the most critical subassemblies as risk of the operation of the OWT in terms of maintainability and availability. The reliability of the power converter is heavily influenced by both its steady-state and its dynamic thermal behavior, and as such great attention will be paid to the literature related to the thermal behaviour of the power converter. This paper seeks to provide a comprehensive overview on how the typical mission profile of an OWT influences the thermal loading. The paper seeks to propose a comprehensive and up-to-date literature review related to the lifetime modelling of the power converter, and to highlight some of the main challenges yet to be tackled in the reliability analysis of the power converter, suggesting future areas of research.

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“…An inspected IGBT module in a power circuit can be taken as a resistor-inductor-capacitor (RLC) network during switching transitions, where the equivalent RLC network is dependent on the joint conditions of the multilayer structure. It has been reported that collector voltage v ce,on under small current [11][12][13] and low order harmonics of the output voltage [14] are effective DSEPs for RLC degradation detection. However, additional auxiliary and sampling circuits for DSEPs measurement are needed during testing.…”

Section: Introductionmentioning

confidence: 99%

Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach

et al. 2020

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In this paper, a non-contact degradation evaluation method for insulated gate bipolar transistor (IGBT) modules is proposed based on eddy current pulsed thermography approach. In non-contact heat excitation procedures, a high-power induction heater is introduced to generate heat excitation in IGBT modules. The thermographs of the whole temperature mapping are recorded non-invasively by an IR camera. As a result, the joint degradation of IGBT modules can be evaluated by the transient thermal response curves derived from the recorded thermographs. Firstly, the non-destructive evaluation principle of the eddy current pulsed thermography (ECPT) system for an IGBT module with a heat sink is introduced. A 3D simulation module is built with physical parameters in ANSYS simulations, and then thermal propagation behavior considering the degradation impact is investigated. An experimental ECPT system is set up to verify the effectiveness of the proposed method. The experimental results show that the delay time to peak temperature can be extracted and treated as an effective indicative feature of joint degradation.

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A Method to Monitor IGBT Module Bond Wire Failure Using On-State Voltage Separation Strategy

Cited by 6 publications

References 31 publications

Ensuring a Reliable Operation of Two-Level IGBT-Based Power Converters: A Review of Monitoring and Fault-Tolerant Approaches

Ensuring a Reliable Operation of Two-Level IGBT-Based Power Converters: A Review of Monitoring and Fault-Tolerant Approaches

Influence of the Mission Profile on The Lifetime Modelling of the Wind Turbine Power Converter – A Review

Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach

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