A Microassembled Low-Profile Three-Dimensional Microelectrode Array for Neural Prosthesis Applications

Yao, Ying; Gulari, Mayurachat Ning; Wiler, James A.; Wise, K.D.

doi:10.1109/jmems.2007.896712

Cited by 75 publications

(66 citation statements)

References 24 publications

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“…This configuration samples extracellular fields from the tip of each shaft, and though the tips are not confined to a single plane, prospects for dense 3D recording appear limited, as there is only one electrode per shaft. Recent efforts at realizing true 3D recording functionality have begun to show promise [9][10][11][12], but the widespread use of those devices appears to remain limited.…”

Section: Introductionmentioning

confidence: 99%

Dual-side and three-dimensional microelectrode arrays fabricated from ultra-thin silicon substrates

Roukes

Masmanidis

2009

J. Micromech. Microeng.

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A method for fabricating planar implantable microelectrode arrays was demonstrated using a process that relied on ultra-thin silicon substrates, which ranged in thickness from 25 to 50 μm. The challenge of handling these fragile materials was met via a temporary substrate support mechanism. In order to compensate for putative electrical shielding of extracellular neuronal fields, separately addressable electrode arrays were defined on each side of the silicon device. Deep reactive ion etching was employed to create sharp implantable shafts with lengths of up to 5 mm. The devices were flip-chip bonded onto printed circuit boards (PCBs) by means of an anisotropic conductive adhesive film. This scalable assembly technique enabled three-dimensional (3D) integration through formation of stacks of multiple silicon and PCB layers. Simulations and measurements of microelectrode noise appear to suggest that low impedance surfaces, which could be formed by electrodeposition of gold or other materials, are required to ensure an optimal signal-to-noise ratio as well a low level of interchannel crosstalk.

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Section: Introductionmentioning

confidence: 99%

Dual-side and three-dimensional microelectrode arrays fabricated from ultra-thin silicon substrates

Roukes

Masmanidis

2009

J. Micromech. Microeng.

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“…This technique spread throughout the MEMS community and formed the basis for many other novel electromechanical structures. The planar lithography approach has evolved over the years to include integrated interconnects 38 , active electronics 35,39,40 , cochlear implants 41,42 , polytrodes 31 , and three-dimensional arrays 29,[43][44][45] . An important simplification for defining and releasing fine neural probe structures has been the use of silicon-on-insulator (SOI) wafers and deep reactive ion etching (DRIE) 46,47 that many groups have adopted.…”

Section: Recording Brain Activity Brief Historymentioning

confidence: 99%

State-of-the-art MEMS and microsystem tools for brain research

et al. 2017

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Mapping brain activity has received growing worldwide interest because it is expected to improve disease treatment and allow for the development of important neuromorphic computational methods. MEMS and microsystems are expected to continue to offer new and exciting solutions to meet the need for high-density, high-fidelity neural interfaces. Herein, the state-of-the-art in recording and stimulation tools for brain research is reviewed, and some of the most significant technology trends shaping the field of neurotechnology are discussed.

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“…In addition, none of these systems were designed for chronic implantation with the exception of recent efforts at the University of Michigan and the University of Utah. The University of Michigan (Gingerich et al 2001;Hoogerwerf and Wise 1994;Kim and Wise 1996;Kipke et al 2003;Yao et al 2003;Yao et al 2007) has pursued a custom systems-level approach and successfully demonstrated neural electrode arrays with integrated signal amplification as well as discrete RF telemetry chips that could be used to build a neural interface system. A new generation neural interface for cortical applications has been developed (Wise et al 2004), which couples wired Michigan electrode arrays with a multi-channel signal processor and RF telemetry unit on a circuit board.…”

Section: Integrated Wireless Neural Interface Microsystemsmentioning

confidence: 99%

“…System integration efforts to build fully or partially integrated, implantable neural interface devices have been pursued by several research teams (Aziz et al 2007;Martel et al 2001;Patterson et al 2004;Stieglitz et al 2000;Stieglitz et al 2005;Yao et al 2007). The techniques used to integrate the microelectrodes with electronics include using an intermediate substrate made of silicon (Yao et al 2007), flip-chip integration using conductive epoxy and thermal curing (Aziz et al 2007;Patterson et al 2004), or using thin film interconnections embedded in a flexible substrate (Martel et al 2001;Stieglitz et al 2000;Stieglitz et al 2005).…”

Section: Integrated Wireless Neural Interface Microsystemsmentioning

confidence: 99%

“…The techniques used to integrate the microelectrodes with electronics include using an intermediate substrate made of silicon (Yao et al 2007), flip-chip integration using conductive epoxy and thermal curing (Aziz et al 2007;Patterson et al 2004), or using thin film interconnections embedded in a flexible substrate (Martel et al 2001;Stieglitz et al 2000;Stieglitz et al 2005). To our knowledge, however, a wireless neural electrode microsystem that is fully integrated with all necessary components through shortest possible interconnections has not been demonstrated to date.…”

Section: Integrated Wireless Neural Interface Microsystemsmentioning

confidence: 99%

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Integrated wireless neural interface based on the Utah electrode array

Kim

Bhandari

Klein

et al. 2008

Biomed Microdevices

149

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This report presents results from research towards a fully integrated, wireless neural interface consisting of a 100-channel microelectrode array, a custom-designed signal processing and telemetry IC, an inductive power receiving coil, and SMD capacitors. An integration concept for such a device was developed, and the materials and methods used to implement this concept were investigated. We developed a multi-level hybrid assembly process that used the Utah Electrode Array (UEA) as a circuit board. The signal processing IC was flip-chip bonded to the UEA using Au/Sn reflow soldering, and included amplifiers for up to 100 channels, signal processing units, an RF transmitter, and a power receiving and clock recovery module. An under bump metallization (UBM) using potentially biocompatible materials was developed and optimized, which consisted of a sputter deposited Ti/Pt/Au thin film stack with layer thicknesses of 50/150/150 nm, respectively. After flip-chip bonding, an underfiller was applied between the IC and the UEA to improve mechanical stability and prevent fluid ingress in in vivo conditions. A planar power receiving coil fabricated by patterning electroplated gold films on polyimide substrates was connected to the IC by using a custom metallized ceramic spacer and SnCu reflow soldering. The SnCu soldering was also used to assemble SMD capacitors on the UEA. The mechanical properties and stability of the optimized interconnections between the UEA and the IC and SMD components were measured. Measurements included the tape tests to evaluate UBM adhesion, shear testing between the Au/Sn solder bumps and the substrate, and accelerated lifetime testing of the long-term stability for the underfiller material coated with a a-SiC(x):H by PECVD, which was intended as a device encapsulation layer. The materials and processes used to generate the integrated neural interface device were found to yield a robust and reliable integrated package.

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A Microassembled Low-Profile Three-Dimensional Microelectrode Array for Neural Prosthesis Applications

Cited by 75 publications

References 24 publications

Dual-side and three-dimensional microelectrode arrays fabricated from ultra-thin silicon substrates

Dual-side and three-dimensional microelectrode arrays fabricated from ultra-thin silicon substrates

State-of-the-art MEMS and microsystem tools for brain research

Integrated wireless neural interface based on the Utah electrode array

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