2023
DOI: 10.3390/ma16124472
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A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading

Abstract: Ag paste has been recognized as a promising substitute for Sn/Pb solder in SiC or GaN power electronic devices, owing to its ability to withstand high temperatures and facilitate low-temperature packing. The reliability of these high-power circuits is greatly influenced by the mechanical properties of sintered Ag paste. However, there exist substantial voids inside the sintered silver layer after sintering, and the conventional macroscopic constitutive models have certain limitation to describe the shear stres… Show more

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