A Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process on Aluminum Alloys at Medium and Low Temperatures

Abstract

Electroless plating is a commonly used method to enhance the corrosion resistance, wear resistance, and decorative performance of aluminum alloys. However, in electroless plating processes, it is customary to maintain the solution temperature at levels exceeding 85°C, a critical condition that ensures a sufficiently rapid deposition rate and thereby fosters the formation of high-performance coatings. Conventional immersion pretreatments with zinc and palladium result in lower deposition rates at low temperatures. This study shows that a copper immersion layer with microporous channels can facilitate the electroless plating process for aluminum alloys at lower temperatures. Through a redox reaction in a Cu2+-containing solution at 70°C, a copper immersion layer with a microporous structure could be created on an aluminum alloy. The microporous channels between the copper immersion layer and the aluminum alloy create electrochemical corrosion cells in the plating solution, accelerating the electroless plating process. The Ni-P coating obtained after pretreatment by copper immersion has a higher hardness (578 HV) and a lower corrosion current density (0.55 μA/cm2). This work provides a practical method to rapidly fabricate high-performance Ni-P coatings at intermediate temperatures (70-75°C).