A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection

Tang, Hui; He, Sifeng; Zhu, Zhongyuan; Gao, Jian; Zhang, Lanyu; Cui, Chengqiang; Chen, Xin

doi:10.1109/tmech.2020.3019431

Cited by 20 publications

(5 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Additionally, the stroke, working frequency range, and the tracking accuracy of the proposed compliant mechanism are ≥100 µm, ≥30 Hz and ±2 µm, respectively [20,21]. The compliant mechanism has the advantages of high precision, low winding, and no friction, and can achieve ultra-high-precision and high-frequency motion within a small range [22][23][24]. Moreover, it has been demonstrated that it is effective for implementing mini-LED precision positioning by utilizing a 2-DOF-compliant mechanism [25][26][27].…”

Section: Introductionmentioning

confidence: 94%

A Novel Compliant 2-DOF Ejector Pin Mechanism for the Mass Transfer of Robotic Mini-LED Chips

Huang

Lin

et al. 2022

Applied Sciences

Self Cite

View full text Add to dashboard Cite

The continuous development of mini-LEDs has led to higher requirements for chip transfer technology, which makes it difficult for the intermittent transfer method with a mechanical ejector pin to meet these requirements. To solve this problem, a novel compliant 2-DOF ejector pin mechanism for the mass transfer of robotic mini-LED chips is proposed in this paper. The compliance matrix method and the Newton method are employed for system kinematic modeling and dynamics modeling, respectively. The static and dynamic analyses of the mechanism are carried out via ANSYS Workbench, and the results of FEA are demonstrated the effectiveness of theoretical calculation. Then, an ILC is utilized to control the device via a parameters regulation approach in the frequency domain. Finally, an open-loop test and a trajectory tracking test for the prototype are carried out verify the effectiveness of proposed device. The test results indicate that the working stroke of the mechanism reaches 120 μm, the natural frequency of the device is 250.85 Hz, the coupling rate is less than ±0.5% and the tracking errors of 10 Hz, 20 Hz and 30 Hz sinusoidal signals are all within ±1.5%. According to the results of theoretical analyses, FEA and test, it has been proved that the designed mechanism for the mass transfer of mini-LED chips is superiority and effective.

show abstract

Section: Introductionmentioning

confidence: 94%

A Novel Compliant 2-DOF Ejector Pin Mechanism for the Mass Transfer of Robotic Mini-LED Chips

Huang

Lin

et al. 2022

Applied Sciences

Self Cite

View full text Add to dashboard Cite

show abstract

“…Notch-type pivots with lumped compliance are commonly used to provide bending and rotation movements, but they have some limitations. For example, they typically have high rotational stiffness, limited stroke length, and high concentrated stress [ 21 , 22 , 23 ]. These drawbacks restrict their application in high-precision positioning tasks.…”

Section: Design Principle Of Mechanismmentioning

confidence: 99%

“…To achieve rotational movement around the X -axis, a cross-axis flexural pivot can be used. This type of pivot has been extensively studied and modeled in previous research as cited in [ 11 , 22 , 24 ]. For this particular study, we selected this compliant module to provide rotational freedom around the X -axis.…”

Section: Design Principle Of Mechanismmentioning

confidence: 99%

A Novel Compliant Connection Mechanism with Thermal Distortion Self-Elimination Function

Huang,

Liao,

Lin

et al. 2024

Micromachines

Self Cite

View full text Add to dashboard Cite

As a novel technology for fabricating large-screen OLED devices, OLED inkjet printing places extreme demands on the positioning accuracy of inkjet printing platforms. However, thermal deformation of the connection mechanism often reduces the printing precision of OLED printing equipment, significantly impacting overall print quality. This study introduces a compliant connection mechanism that achieves precise positioning of the inkjet printing platform and can self-eliminate thermal distortion. The design of the mechanism’s core component is based on the Freedom and Constraint Topology (FACT) principle. This component is constructed from three distinct compliant sections arranged in series, collectively providing three degrees of freedom. Furthermore, the resistance to deformation caused by gravity and other external forces was evaluated by analyzing both vertical and horizontal stiffness. To validate the mechanism’s thermal distortion elimination and gravity resistance capabilities, finite element analysis (FEA) was carried out. The results demonstrate that the mechanism effectively reduces the maximum deformation of the platform by approximately 46% and the average deformation across the entire platform by approximately 59%. These findings confirm that the mechanism has potential in high-precision positioning tasks that need to mitigate thermal distortion.

show abstract

“…due to the smaller the table height-todiameter ratio, the higher the advantages of equipment integration and stability, this paper designs the device height of only 75 mm. Considering the need for high precision and large stroke the SPAS is designed based on a compliant structure with a simple and compact configuration, no motion friction [30,31]. The stage employs piezoelectric ceramics as actuators.…”

Section: Introductionmentioning

confidence: 99%

Design and Testing of a Compliant ZTTΘ Positional Adjustment System with Hybrid Amplification

Liao,

Lin,

Tang

et al. 2024

Micromachines

Self Cite

View full text Add to dashboard Cite

This article presents the design, analysis, and prototype testing of a four-degrees-of-freedom (4-DoFs) spatial pose adjustment system (SPAS) that achieves high-precision positioning with 4-DoFs (Z/Tip/Tilt/Θ). The system employs a piezoelectric-driven amplification mechanism that combines a bridge lever hybrid amplification mechanism, a double four-bar guide mechanism, and a multi-level lever symmetric rotation mechanism. By integrating these mechanisms, the system achieves low coupling, high stiffness, and wide stroke range. Analytical modeling and finite element analysis are employed to optimize geometric parameters. A prototype is fabricated, and its performance is verified through testing. The results indicate that the Z-direction feed microstroke is 327.37 μm, the yaw motion angle around the X and Y axes is 3.462 mrad, and the rotation motion angle around the Z axis is 12.684 mrad. The x-axis and y-axis motion magnification ratio can reach 7.43. Closed-loop decoupling control experiments for multiple-input-multiple-outputs (MIMO) systems using inverse kinematics and proportional-integral-derivative feedback controllers were conducted. The results show that the Z-direction positioning accuracy is ±100 nm, the X and Y axis yaw motion accuracy is ±2 μrad, and the Z-axis rotation accuracy is ±25 μrad. Due to the ZTTΘ mechanism, the design proved to be feasible and advantageous, demonstrating its potential for precision machining and micro-nano manipulation.

show abstract

A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection

Cited by 20 publications

References 32 publications

A Novel Compliant 2-DOF Ejector Pin Mechanism for the Mass Transfer of Robotic Mini-LED Chips

A Novel Compliant 2-DOF Ejector Pin Mechanism for the Mass Transfer of Robotic Mini-LED Chips

A Novel Compliant Connection Mechanism with Thermal Distortion Self-Elimination Function

Design and Testing of a Compliant ZTTΘ Positional Adjustment System with Hybrid Amplification

Contact Info

Product

Resources

About