A More Than Moore Enabling Wafer Dicing Technology

Borkulo, Jeroen van; Evertsen, Rogier; Stam, Richard van der

doi:10.1109/ectc.2019.00071

Cited by 4 publications

(1 citation statement)

References 6 publications

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“…We assessed changes in knowledge structure from kindergarten to first grade in (a) global network structure, (b) global network strength (i.e., weighted absolute sum of all edges), and (c) specific edge weights between the early- and later-knowledge networks using the network comparison test—a two-tailed permutation test—for repeated paired measurements with 1,000 iterations (van Borkulo, 2019). The network comparison test revealed that although the global network structure did not change across time points, p = .445, there was a significant increase in global network density from kindergarten (strength = 2.31) to first grade (strength = 2.57), S = 0.26, p = .001.…”

Section: Resultsmentioning

confidence: 99%

A Network Analysis of Children’s Emerging Place-Value Concepts

et al. 2022

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Examining how informal knowledge systems change after formal instruction is imperative to understanding learning processes and conceptual development and to implementing effective educational practices. We used network analyses to determine how the organization of informal knowledge about multidigit numbers in kindergartners ( N = 279; mean age = 5.76 years, SD = 0.55; 135 females) supports and is transformed by a year of in-school formal instruction. The results show that in kindergarten, piecemeal knowledge about the surface properties of reading and writing multidigit numbers and the use of base-10 units to determine large quantities are strongly associated with each other and connected in a stringlike manner to other emerging skills. After a year of instruction, each skill becomes connected to the “hub” abilities of reading and writing multidigit numbers, which also become strongly connected to more advanced knowledge of base-10 principles. These findings provide new insights into how partial knowledge provides the backbone on which explicit principles are learned.

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Section: Resultsmentioning

confidence: 99%

A Network Analysis of Children’s Emerging Place-Value Concepts

et al. 2022

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State-Of-The-Art of Advanced Packaging

Lau¹

2023

Chiplet Design and Heterogeneous Integration Packaging

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3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process

Mohammad Nazri,

Yong,

Yusof

et al. 2024

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Purpose Die edge quality with its corresponding die strength are two important factors for excellent dicing quality especially for low-k wafers due to their weak mechanical properties and fragile structures. It is shown in past literatures that laser dicing or grooving does yield good dicing quality with the elimination of die mechanical properties. This is due to the excess heat energy that the die absorbs throughout the procedure. Within the internal structure, the mechanical properties of low-k wafers can be further enhanced by modification of the material. The purpose of this paper is to strengthen the mechanical properties of wafers through the heat-treatment process. Design/methodology/approach The methodology of this approach is by heat treating several low-k wafers that are scribed with different laser energy densities with different laser micromachining parameters, i.e. laser power, frequency, feed speed, defocus reading and single/multibeam setup. An Nd:YAG ultraviolet laser diode that is operating at 355 nm wavelength was used in this study. The die responses from each wafer are thoroughly visually inspected to identify any topside chipping and peeling. The laser grooving profile shape and deepest depth are analysed using a laser profiler, while the sidewalls are characterized by scanning electron microscopy (SEM) to detect cracks and voids. The mechanical strength of each wafer types then undergoes three-point bending test, and the performance data is analyzed using Weibull plot. Findings The result from the experiment shows that the standard wafers are most susceptible to physical defects as compared to the heat-treated wafers. There is improvement for heat-treated wafers in terms of die structural integrity and die strength performance, which revealed a 6% increase in single beam data group for wafers that is processed using high energy density laser output but remains the same for other laser grooving settings. Whereas for multibeam data group, all heat-treated wafer with different laser settings receives a slight increase at 4% in die strength. Originality/value Heat-treatment process can yield improved mechanical properties for laser grooved low-k wafers and thus provide better product reliability.

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A More Than Moore Enabling Wafer Dicing Technology

Cited by 4 publications

References 6 publications

A Network Analysis of Children’s Emerging Place-Value Concepts

A Network Analysis of Children’s Emerging Place-Value Concepts

State-Of-The-Art of Advanced Packaging

3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process

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