A multi level modeling approach with boundary condition import for system, sub-system or board level thermal characterization

Shankaran, Gokul

doi:10.1109/stherm.2002.991343

Cited by 6 publications

(3 citation statements)

References 4 publications

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“…Leung et al (2000) developed a numerical solution to the steady-state forced convection for air flowing through a horizontally oriented PCB assembly under laminar flow conditions. Shankaran and Karimanal (2002) proposed the "zoom-in modeling" for accurate and time-efficient CFD design calculations for a populated system cooled by forced airflow. Leon et al (2002) used the FLUENT code to obtain the optimal layout for cooling fins in forced-convection cooling by uniquely considering both the heat flux and flow resistance.…”

Section: Introductionmentioning

confidence: 99%

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Leong

Abdullah

Khor

et al. 2013

Microelectronics International

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Purpose -The flexible printed circuit board (FPCB) can be an alternative to the rigid printed circuit board because of its excellent flexibility, twistability, and light weight. Using FPCB to construct personal computer (PC) motherboard is still rare. Therefore, the present study aims to investigate the fluidstructure interaction (FSI) behaviors of the newly proposed FPCB motherboard under fan-flow condition in the PC casings. Design/methodology/approach -The deflection and stress induced, which are usually ignored in the traditional rigid motherboard, are the main concern in the current FPCB motherboard studies. Only a few studies have been conducted on the effect of inlet locations, effect of inlet sizes, effect of multi-inlets, and effect of a two-fan system. These numerical analyses are performed using the fluid flow solver FLUENT and the structural solver ABAQUS; they are real-time online coupled by Mesh-based Parallel Code Coupling Interface (MpCCI). Findings -A smaller inlet size can cause higher deflection and stress fluctuations, but the fluctuations can be reduced by incorporating the multi-inlets design. In addition, the inlet locations and two-fan system can prominently affect the magnitudes of the deflection and stress induced.Practical implications -The current study provides better understanding and allows designers to be aware of the FSI phenomenon when dealing with the FPCB motherboard. Although the present study primarily focuses on the motherboard, the findings could also contribute valuable information for other FPCB applications. Originality/value -The present study extends the FSI investigation from the previous novel approach of FPCB motherboard, and uniquely explores the behaviors of the FPCB motherboard inside different PC casings.

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Section: Introductionmentioning

confidence: 99%

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Leong

Abdullah

Khor

et al. 2013

Microelectronics International

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“…The Fig. 3. Peak and average temperature reduction as a function of normalized area when using MC tions.…”

Section: Performance Headroommentioning

confidence: 99%

“…II. RELATED WORKS Thermal-aware design techniques for electronic systems have mainly focused on the board level or package level [3][4]. Thermal placement for standard cell ASIC design has been investigated for several years.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Thermal-Aware Design Techniques for Microprocessors

Richardson

Xie

2005 6th International Conference on ASIC

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As technology scales, temperature in modern highperformance VLSI circuits has increased dramatically. Temperature affects not only the performance but also the power, reliability, and cost of the system. In this paper, we examine two approaches to reduce the on-chip temperature: one is to reduce the power densities of hot functional units by allocating more die area (growing units), and the other one is to use three different migrating computation (MC) techniques to migrate activities among duplicated functional units. Through the use of tools for architectural power and temperature estimation, the effectiveness of these two methods are evaluated for the Alpha 21264 microprocessor.

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Using state-space models for accurate computations of transient thermal behavior of electronic packages

Shankaran

Doğruöz

Magargle

2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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A multi level modeling approach with boundary condition import for system, sub-system or board level thermal characterization

Cited by 6 publications

References 4 publications

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Evaluation of Thermal-Aware Design Techniques for Microprocessors

Using state-space models for accurate computations of transient thermal behavior of electronic packages

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