A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging

Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

“…In this context, the addition of an inorganic filler into an EP matrix to form effective composites is a potential route to improve the performance of the final product. For this purpose, many types of inorganic or metallic fillers with high thermal conductivity, low thermal expansion coefficient, and low electrical conductivity, such as silica [5,6,7,8,9,10], alumina (Al 2 O 3 ) [11,12,13,14], aluminum nitride [15,16,17,18], and hexagonal boron nitride (BN) [19,20,21,22,23,24,25] were studied. Model predictions of and experimental studies on the effects of graphite or graphene oxide on EP resins were also reported [26,27,28].…”

A study on mechanical, thermal, and electrical properties of glass fiber-reinforced epoxy hybrid composites filled with plasma-synthesized AlN

“…7 Generally, thermal expansion of epoxy is lowered by reinforcing ceramic powders such as fused silica or quartz to more closely match that of the encapsulated metal lead frames and semiconductor dies. 8 This prevents damage to the device from thermal cycling and reduces compressive and shear forces on the surface of the semiconductor. Very large-scale integration semiconductor devices produce heat when they operate.…”