A Multiple Particle Model for the Prediction of Electrical Contact Resistance in Anisotropic Conductive Adhesive Assemblies

Chin, Melida; Hu, S. Jack

doi:10.1109/tcapt.2007.910136

Cited by 13 publications

(2 citation statements)

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“…in assessing the overall electrical performance of such adhesives, parameters such as number of particles, spatial distribution of the particles, and magnitude of the initial bonding force, will be important. Chin and Hu (2007) have detailed both theoretical and finite element models for predicting the electrical performance of anisotropic conductive adhesives. Unlike previous work in this area, they demonstrated a multiple particle model which did not assume that the electrical contact resistance for each particle was the same.…”

Section: Chipmentioning

confidence: 99%

Modelling techniques used to assess conductive adhesive properties

Bailey

2011

Advanced Adhesives in Electronics

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Section: Chipmentioning

confidence: 99%

Modelling techniques used to assess conductive adhesive properties

Bailey

2011

Advanced Adhesives in Electronics

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“…Chiang et al [6] evaluated process-induced effects on contact force of a 3-D NiP using the equivalent spring method. Chin et al [7], [8] considered the effects of elastic recovery and multiple conductive particles on electrical contact resistance, especially when bonding force is removed once the ACA resin has cured (unloading) to achieve a detailed analysis of the delamination due to residual stress. A number of studies have examined metal conductive particles.…”

mentioning

confidence: 99%

Investigation of Electrical Contact Mechanism for Anisotropic Conductive Adhesive Joints After the Thermocompression

Chu

Chen

2013

IEEE Trans. Device Mater. Relib.

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Flexible interconnects are needed that meet assembly requirements for future applications in flexible consumer electronics products. This work investigates the electrical contact mechanism of ultrathin chip-on-flex (UTCOF) package using anisotropic conductive adhesive (ACA), which is highly flexible. In this paper, a 3-D nonlinear finite element (FE) model, which integrates analytical models of ACA joints and the thermal-mechanical behaviors of the UTCOF, is presented. The model is then applied to simulate the electrical contact mechanism for various ACA joints after thermocompression. Moreover, a "death-birth" meshing scheme is utilized to determine the effect of ACA resin temperature on contact resistance of the ACA joints. Multiple particle models are also generated using the ANSYS program. To validate the suitability of the proposed FE analytical model, contact resistance is measured to determine the bonding quality for 80-μm-pitch UTCOF test samples. The interfaces between the silicon chip and substrate for samples bonded under different bonding pressures are observed using cross-sectional scanning electron microscopy. The contact resistances obtained from the 3-D FE models were in good agreement with experimental results and can be used to predict the effects of thermocompression loading, pressure unloading, and cooling to room temperature on electrical contact mechanism in ACA joints after thermocompression. Generally, the gold bump and the compliant bump joined with multiple conductive particles reached stable contact resistance by capturing five to nine conductive particles. Contact resistance of an ACA-bonded UTCOF can be estimated using a proposed empirical model equation, particularly under loading conditions of L = 40%−60%. Overall, this work improves the design of flip chips for flexible electronics and the understanding of the electrical contact mechanism for ACA joints.Index Terms-Anisotropic conductive adhesive (ACA), electrical contact mechanism, finite element (FE) model, ultrathin chip-on-flex (UTCOF).

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