A nanometre-scale fibre-to-matrix interface characterization of an ultrasonically consolidated metal matrix composite

Friel, Ross J.; Harris, Russell A.

doi:10.1243/14644207jmda268

Cited by 23 publications

(29 citation statements)

References 19 publications

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“…80 mm by 25 mm) and then coating it with a layer of self-adhesive polyimide tape (75 μm thick Kapton™ tape). This aluminium substrate is commonly used with UAM [6][7][8]26] and the polyimide tape has excellent insulating, mechanical and thermal properties. The polyimide tape also provides an excellent surface for the dispensing of the conductive materials and past research has shown that it can withstand the mechanical loads introduced during UAM [10].…”

Section: Sample Preparation and Syringe Dispensingmentioning

confidence: 99%

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The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

Bournias-Varotsis

Wang

Hutt

et al. 2018

Electron. Mater. Lett.

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Ultrasonic additive manufacturing (UAM) is a low temperature manufacturing method capable of embedding printed electronics in metal components. The effect of UAM processing on the resistivity of conductive tracks printed with five different conductive pastes based on silver, copper or carbon flakes/particles in either a thermoplastic or thermoset filler binder are investigated. For all but the carbon-based paste, the resistivity changed linearly with the UAM energy input. After UAM processing, a resistivity increase of more than 150 times was recorded for the copper based thermoset paste. The silver based pastes showed a resistivity increase of between 1.1 and 50 times from their initial values. The carbon-based paste showed no change in resistivity after UAM processing. Focussed ion beam microstructure analysis of the printed conductive tracks before and after UAM processing showed that the silver particles and flakes in at least one of the pastes partly dislodged from their thermoset filler creating voids, thereby increasing the resistivity, whereas the silver flakes in a thermoplastic filler did not dislodge due to material flow of the polymer binder. The lowest resistivity (8 × 10 −5 Ω cm) after UAM processing was achieved for a thermoplastic paste with silver flakes at low UAM processing energy. Graphical Abstract

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Section: Sample Preparation and Syringe Dispensingmentioning

confidence: 99%

“…This allowed researchers in the past to create composite metal matrix structures with embedded functional materials and other smart features, such as optical fibres [5,6], shape memory alloy fibres [7,8], other shape memory and magnetostrictive materials for embedded sensing applications [9] and smart switches for a structural antenna [10].…”

mentioning

confidence: 99%

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

Bournias-Varotsis

Wang

Hutt

et al. 2018

Electron. Mater. Lett.

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“…The most applicable method based on prior literature is Focussed Ion Beam (FIB) milling in combination with Dual SEM imaging in order to analyse and assess the grain structure of the processed materials (Friel and Harris, 2010). This was performed through the use of a Nova 600 Nanolab Dual Beam Focused Ion Beam -Scanning Electron Microscope (FEI, Oregan, USA).…”

Section: Surface Grain Refinementmentioning

confidence: 99%

Enabling internal electronic circuitry within additively manufactured metal structures – the effect and importance of inter-laminar topography

Monaghan

Kay

et al. 2018

RPJ

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Purpose -This research aims to exploit the potential of Ultrasonic Additive Manufacturing (UAM) in the embedding of printed electrical materials directly into the interlaminar region of parts during manufacture in order to realise novel multifunctional Metal Matix Composite's (MMC's).Design/methodology/approach -To ensure the proper electrical insulation between the printed conductor and metal matrices, an insulation layer with sufficient thickness is required to adapt the rough interlaminar surface geometry caused by the transfer of the sonotrode topography during the UAM process. This in turn increases the total thickness of printed circuitries and thereby adversely affects the integrity of the UAM part. This work proposes a unique solution to overcome this rough interlaminar surface through deformation of the UAM substrates via sonotrode rolling or UAM processing.Findings -The surface roughness (Sa) of UAM substrates could be reduced from 4.5 µm to 4.1 µm by sonotrode rolling and from 4.5 µm to 0.8 µm by ultrasonic deformation. Peel testing demonstrated that sonotrode rolled substrates could maintain their mechanical strength, whilst the performance of substrates deformed with UAM degraded under same welding conditions (~12% reduction compared with undeformed substrates). This observation was attributed to the work hardening effect of deformation process which was identified via DualBeam FIB-SEM investigation.Originality/value -The rolling deformation process (without ultrasonic assistance) was adopted in the further fabrication of multifunctional MMC's. This method enabled a decrease in the thickness of printed electrical circuitries by ca. 25%.

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“…A second unique feature of UAM that makes it highly suitable for manufacturing MMCs is the large degree of localized plastic flow observed in the interlaminar region during foil deposition. This plastic flow allows for sound mechanical encapsulation of components by the matrix material [11]. To date, this ability has been utilized to incorporate a variety of fibers such as Silicon Carbide (SiC) for localized stiffening, Shape Memory Alloy (SMA) http for actuation and optical fibers for sensing [12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Solid-state additive manufacturing for metallized optical fiber integration

Monaghan

Capel

Christie

et al. 2015

Composites Part A: Applied Science and Manufacturing

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a b s t r a c tThe formation of smart, Metal Matrix Composite (MMC) structures through the use of solid-state Ultrasonic Additive Manufacturing (UAM) is currently hindered by the fragility of uncoated optical fibers under the required processing conditions. In this work, optical fibers equipped with metallic coatings were fully integrated into solid Aluminum matrices using processing parameter levels not previously possible. The mechanical performance of the resulting manufactured composite structure, as well as the functionality of the integrated fibers, was tested. Optical microscopy, Scanning Electron Microscopy (SEM) and Focused Ion Beam (FIB) analysis were used to characterize the interlaminar and fiber/matrix interfaces whilst mechanical peel testing was used to quantify bond strength. Via the integration of metallized optical fibers it was possible to increase the bond density by 20-22%, increase the composite mechanical strength by 12-29% and create a solid state bond between the metal matrix and fiber coating; whilst maintaining full fiber functionality.

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A nanometre-scale fibre-to-matrix interface characterization of an ultrasonically consolidated metal matrix composite

Cited by 23 publications

References 19 publications

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

Enabling internal electronic circuitry within additively manufactured metal structures – the effect and importance of inter-laminar topography

Solid-state additive manufacturing for metallized optical fiber integration

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