2023 International Conference on Electronics Packaging (ICEP) 2023
DOI: 10.23919/icep58572.2023.10129667
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A New Authentication Method Using The Smart Individuality Printing to Improve The Traceability of Semiconductor Packages

K. Takano
1
,
Akira Miyazaki2,
Mamoru Saitō3
et al.
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