A new ceramic thread-guide composition via low-pressure injection molding

Toy, Ç.; Palacı, Yüksel; Baykara, T.

doi:10.1016/0924-0136(94)01607-3

Cited by 5 publications

(5 citation statements)

References 3 publications

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“…After this step, the porosity should ideally be interconnected, and the compact should be reasonably permeable. The heat breakdown of the residual binder is the second phase [90]. Here, the residual components of the binder are evaporated and depolymerized through heat.…”

Section: Thermal Wick Debindingmentioning

confidence: 99%

“…Because thermal degradation and evaporation create gases, current thermal techniques need a prolonged thermal debinding step with heating rates between 5 and 10 K/h to prevent the formation of bubbles and flaws in the compact. However, with the wicking approach, most binders are removed in the liquid condition, resulting in fewer flaws and a shorter time to remove the remaining binders [90].…”

Section: Thermal Wick Debindingmentioning

confidence: 99%

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Research Progress on Low-Pressure Powder Injection Molding

et al. 2022

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Powder injection molding (PIM) is a well-known technique to manufacture net-shaped, complicated, macro or micro parts employing a wide range of materials and alloys. Depending on the pressure applied to inject the feedstock, this process can be separated into low-pressure (LPIM) and high-pressure (HPIM) injection molding. Although the LPIM and HPIM processes are theoretically similar, all steps have substantial differences, particularly feedstock preparation, injection, and debinding. After decades of focusing on HPIM, low-viscosity feedstocks with improved flowability have recently been produced utilizing low-molecular-weight polymers for LPIM. It has been proven that LPIM can be used for making parts in low quantities or mass production. Compared to HPIM, which could only be used for the mass production of metallic and ceramic components, LPIM can give an outstanding opportunity to cover applications in low or large batch production rates. Due to the use of low-cost equipment, LPIM also provides several economic benefits. However, establishing an optimal binder system for all powders that should be injected at extremely low pressures (below 1 MPa) is challenging. Therefore, various defects may occur throughout the mixing, injection, debinding, and sintering stages. Since all steps in the process are interrelated, it is important to have a general picture of the whole process which needs a scientific overview. This paper reviews the potential of LPIM and the characteristics of all steps. A complete academic and research background survey on the applications, challenges, and prospects has been indicated. It can be concluded that although many challenges of LPIM have been solved, it could be a proper solution to use this process and materials in developing new applications for technologies such as additive manufacturing and processing of sensitive alloys.

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Section: Thermal Wick Debindingmentioning

confidence: 99%

Section: Thermal Wick Debindingmentioning

confidence: 99%

Research Progress on Low-Pressure Powder Injection Molding

et al. 2022

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“…Exemplos de ligantes usados no VO e citados na literatura incluem termoplásticos, termofixos, ceras, compostos orgânicos solúveis em água, entre outros. Na MI em alta pressão, os polímeros que são normalmente utilizados como ligantes principais são capazes de conferir rigidez à peça moldada, especialmente durante a extração dos ligantes [7,10,12]. Por outro lado, o maior peso molecular dos polímeros dificulta sua remoção de peças espessas, especialmente aquelas feitas com pó submicrométrico, o que torna o processo de extração extremamente lento.…”

Section: Veículo Orgânicounclassified

“…Neste processo, a mistura pode ser feita na própria injetora (ver Fig.1), a temperatura e a pressão de injeção são consideravelmente menores (0,2 a 0,6 MPa) e os moldes podem apresentar baixa resistência mecânica, sendo portanto bem mais baratos [10,16]. De acordo com Lenk [1,2], este tipo de moldagem foi originalmente proposta por Griboski há cerca de 50 anos.…”

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Moldagem por injeção em baixa pressão de peças complexas de cerâmicas avançadas produzidas com pós submicrométricos

2004

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A moldagem por injeção em baixa pressão (MIBP) tem constituído, nos últimos anos, uma excelente alternativa para a produção de pequenos lotes de peças cerâmicas diversificadas e com formas complexas. Esta técnica de conformação é relativamente simples e barata, mas apresenta diversos problemas na etapa de extração dos ligantes, principalmente quando o pó cerâmico é muito fino e as peças possuem grande seção transversal. Neste trabalho é descrita uma metodologia específica para a produção de peças cerâmicas por moldagem por injeção a baixa pressão de alumina submicrométrica (0,4 mim), incluindo a formulação da mistura para injeção, bem como detalhes do processo de extração dos ligantes orgânicos utilizados na moldagem. Para o desenvolvimento deste processo fez-se necessário (i) entender melhor o processo de MIBP, (ii) desenvolver a formulação da mistura de pó cerâmico e aditivos orgânicos, (iii) confeccionar moldes adequados para a injeção a baixas pressões e (iv) otimizar os parâmetros de injeção. A metodologia desenvolvida neste trabalho, possibilita a confecção de peças cerâmicas complexas, com seção transversal relativamente grande, permitindo uma produção robusta de pequenos lotes de peças cerâmicas diversificadas com ótima qualidade e excelente reprodutibilidade.

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“…Based on the two-component injection molding process, it is possible to produce components with a rigid exterior and a tough core. A low-pressure injection molding technique [131] has been used as a method for fabricating ceramic thread-guide components used in the textile industry. Injection molding has great promise for fabrication on the < 100 nm scale, although the required technology has not yet been developed.…”

Section: Molding Of Organic Polymersmentioning

confidence: 99%

Microfabrication, Microstructures and Microsystems

Qin

Xia

Rogers

et al. 1998

Topics in Current Chemistry

136

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This review gives a brief introduction to materials and techniques used for microfabrication. Rigid materials have typically been used to fabricate microstructures and systems. Elastomeric materials are becoming attractive, and may have advantages for certain types of applications. Photolithography is the most commonly used technique for the fabrication of structures for microelectronic circuits, microelectromechanical systems, microanalytical devices and micro-optics. Soft lithography represents a set of non-photolithographic techniques: it forms micropatterns of self-assembled monolayers (SAMs) by contact printing and generates microstructures of polymers by contact molding. The aim of this paper is to illustrate how non-traditional materials and methods for fabrication can yield simple, cost-effective routes to microsystems, and now they can expand the capabilities of these systems.

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A new ceramic thread-guide composition via low-pressure injection molding

Cited by 5 publications

References 3 publications

Research Progress on Low-Pressure Powder Injection Molding

Research Progress on Low-Pressure Powder Injection Molding

Moldagem por injeção em baixa pressão de peças complexas de cerâmicas avançadas produzidas com pós submicrométricos

Microfabrication, Microstructures and Microsystems

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