A New Course on Product Development for Electronics Engineering Technology

Morgan, Joseph A.; Porter, Jay; Zhan, Wei

doi:10.18260/1-2--19093

2013 ASEE Annual Conference &Amp; Exposition Proceedings

DOI: 10.18260/1-2--19093

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A New Course on Product Development for Electronics Engineering Technology

Joseph A. Morgan¹,

Jay Porter²,

Wei Zhan³

Abstract: has over 20 years of military and industry experience in electronics and telecommunications systems engineering. He joined the Engineering Technology and Industrial Distribution Department in 1989 and has served as the Program Director of the Electronics and Telecommunications Programs and as the Associate Department Head for Operations. He received his BS degree in electrical engineering (1975) from California State University, Sacramento, and his MS (1980) and DE (1983) degrees in industrial engineering fr… Show more

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Modular Integrated Stackable Layer (MISL): An Academic–Public Sector Partnership for Rapid Prototyping and Development

Morgan

Porter

2015 ASEE Annual Conference and Exposition Proceedings

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The rapid product development process continues to increase its demands on hardware prototyping tools. These tools need to create prototypes with higher levels of functional integration necessary to accommodate a diverse selection of embedded intelligence, sensors, actuators, communications and data storage technologies. In addition, the turn-around time from prototype to commercialized product continues to decrease so that companies can be first to market, thus gaining important market share. Although there are a number of hardware development tools available, none of these fully meets the demanding requirements of the aerospace, automotive, communications, medical, petrochemical industries 1. Based on a number of successful applied research and capstone design projects, the Controls and Data Handling Branch at National Aeronautics and Space Administration -Johnson Space Center (NASA-JSC) recently formed a development partnership for its unique Modular Integrated Stackable Layer (MISL) architecture with the Electronic Systems Engineering Technology Program (ESET) at Texas A&M University. The MISL architecture encompasses a series of layers (printed circuit boards) that can be quickly "stacked" into a small form factor footprint that provides a wide range of technologies. Developers can quickly configure an application-specific configuration by selecting from multiple options for power, microcontroller, communications, sensors and other signal conditioning circuitry. The ESET Program has three primary responsibilities to the newly formed partnership: 1) New layer design, 2) Educational course and laboratory material development, 3) Establishment of an open development community environment. This paper provides an overview of the MISL partnership, the educational and research activities that have been successfully conducted to date, the lessons learned, and the move forward plans for the space qualified rack-and-stack hardware development platform.

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Modular Integrated Stackable Layer (MISL): An Academic–Public Sector Partnership for Rapid Prototyping and Development

Morgan

Porter

2015 ASEE Annual Conference and Exposition Proceedings

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A New Course on Product Development for Electronics Engineering Technology

Cited by 1 publication

References 5 publications

Modular Integrated Stackable Layer (MISL): An Academic–Public Sector Partnership for Rapid Prototyping and Development

Modular Integrated Stackable Layer (MISL): An Academic–Public Sector Partnership for Rapid Prototyping and Development

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