1994
DOI: 10.1016/0040-6031(94)85047-x
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A new high-performance thermoplastic polyimide and its fiber-reinforced composites

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Cited by 6 publications
(6 citation statements)
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“…PI materials are largely used in aerospace, microelectronics, or automotive industries as high‐temperature composites, adhesives, dielectrics, photoresists, nonlinear optical, and membrane materials . In particular, they have found a number of applications in mechanical engineering as structural materials …”
Section: Introductionmentioning
confidence: 99%
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“…PI materials are largely used in aerospace, microelectronics, or automotive industries as high‐temperature composites, adhesives, dielectrics, photoresists, nonlinear optical, and membrane materials . In particular, they have found a number of applications in mechanical engineering as structural materials …”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, this method cannot be used for the preparation of uniform thick films on substrates or large pieces with complex geometries . To obtain such pieces without solvent evaporation during the processing stage, an alternative “dry” method applying the powder consolidation technique was reported in the literature, as summarized in Table . The PAA is dried directly after its synthesis to obtain a powder which will be consolidated by sintering.…”
Section: Introductionmentioning
confidence: 99%
“…According to the summary of the results of the studies conducted by Lu et al, [8] Sue et al, [10] and Livengood et al [9] given in Table 6, PAAS-T exhibited much more enhanced results in terms of flexural strength, flexural modulus and onset temperature in the DMA. Moreover, PAA-TS also exhibited enhanced results compared to those reported in most studies in the literature.…”
Section: Resultsmentioning
confidence: 93%
“…The composite containing BTDA/3,4 ODA/PA exhibited a flexural strength of 536 MPa and a flexural modulus of 95 GPa, while the composite containing BTDA-BPDA (9:1)/3,4 ODA/PA exhibited a flexural strength of 500 MPa and a flexural modulus of 90.5 GPa. Livengood et al [9] synthesized a PAA precursor resin from BTDA and 2,2 0 -dimethyl-1,3-(4-aminophenoxy)propane and prepared CF-reinforced thermoplastic PI matrix composites. They used the T650 carbon unidirectional fiber and manufactured the composites with the drum winding method.…”
Section: Introductionmentioning
confidence: 99%
“…5 Therefore, great efforts have been devoted to the development of high-performance melt-processable TPIs which can be used as high-temperature matrix resins for advanced composites. 6–8…”
Section: Introductionmentioning
confidence: 99%