A new hybrid fabrication process for a high sensitivity MEMS microphone

Chao, Paul C.-P.; Tsai, Chun-Yin; Chiu, Chian‐Song; Tsai, Chuen-Tinn; Tu, Tse-Yi

doi:10.1007/s00542-013-1829-5

Cited by 9 publications

(3 citation statements)

References 10 publications

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“…For example, Martin et al applied their microphone for aeroacoustic measurement with frequency range from 300 Hz to 20 kHz [27]. Several groups designed their prototypes as hearing aid devices with different f o , i.e., 4 kHz [80], 10 kHz [106] and 14 kHz [43].…”

Section: Resonant Frequencymentioning

confidence: 99%

A Review of MEMS Capacitive Microphones

et al. 2020

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This review collates around 100 papers that developed micro-electro-mechanical system (MEMS) capacitive microphones. As far as we know, this is the first comprehensive archive from academia on this versatile device from 1989 to 2019. These works are tabulated in term of intended application, fabrication method, material, dimension, and performances. This is followed by discussions on diaphragm, backplate and chamber, and performance parameters. This review is beneficial for those who are interested with the evolutions of this acoustic sensor.

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Section: Resonant Frequencymentioning

confidence: 99%

A Review of MEMS Capacitive Microphones

et al. 2020

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“…While this approach has been demonstrated to be effective in avoiding capillary-induced stiction, it is ineffective for electrostatic-induced stiction. Another approach is to remove the handle silicon under the suspended structure by the doublesided etching technique [8,9]. The double-sided etching technique avoids the stiction fundamentally, but the dicing damage issue remains.…”

Section: Introductionmentioning

confidence: 99%

An SOI-based post-fabrication process for compliant MEMS devices

Hao,

Wang,

Liu

et al. 2024

J. Micromech. Microeng.

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Fabricating compliant microelectromechanical system (MEMS) devices is challenging because they are easily damaged during fabrication. This paper presents a fabrication process based on the silicon-on-insulator (SOI) wafer for compliant MEMS devices. In the fabrication process, tethers were used to enhance the strength of the compliant devices during fabrication and finally melted with an electric current to release the device after fabrication. We discover that the power supply mode and voltage value are very critical for low-resistance tether melting. The fabrication results show that the yield rate of the compliant microgripper increased from 44% to 100%, which is a significant improvement compared with conventional processes. The successful fabrication of the microgripper proved that the proposed SOI-based post-fabrication process is feasible and can be used to fabricate different kinds of compliant devices.

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“…The low cost and high yield of MEMS microphone can be fabricated using combination of surface and bulk micromachining techniques [1,2]. Basically, MEMS microphones are widely applied in mobile devices [3], aeroacoustic measurement [4], hearing aid [5][6][7][8][9], and biomedical devices [10]. One of the most successfully-developed MEMS sensors is capacitive microphone consisting of thin and movable diaphragm separated by air gap with rigid perforated backplate.…”

Section: Introductionmentioning

confidence: 99%

Mechanical performance of SiC based MEMS capacitive microphone for ultrasonic detection in harsh environment

Zawawi¹,

Hamzah²,

Mohd-Yasin

et al. 2017

Nanoengineering: Fabrication, Properties, Optics, and Devices XIV

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In this project, SiC based MEMS capacitive microphone was developed for detecting leaked gas in extremely harsh environment such as coal mines and petroleum processing plants via ultrasonic detection. The MEMS capacitive microphone consists of two parallel plates; top plate (movable diaphragm) and bottom (fixed) plate, which separated by an air gap. While, the vent holes were fabricated on the back plate to release trapped air and reduce damping. In order to withstand high temperature and pressure, a 1.0 µm thick SiC diaphragm was utilized as the top membrane. The developed SiC could withstand a temperature up to 1400°C. Moreover, the 3 µm air gap is invented between the top membrane and the bottom plate via wafer bonding. COMSOL Multiphysics simulation software was used for design optimization. Various diaphragms with sizes of 600 µm 2 , 700 µm 2 , 800 µm 2 , 900 µm 2 and 1000 µm 2 are loaded with external pressure. From this analysis, it was observed that SiC microphone with diaphragm width of 1000 µm 2 produced optimal surface vibrations, with first-mode resonant frequency of approximately 36 kHz. The maximum deflection value at resonant frequency is less than the air gap thickness of 8 µm, thus eliminating the possibility of shortage between plates during operation. As summary, the designed SiC capacitive microphone has high potential and it is suitable to be applied in ultrasonic gas leaking detection in harsh environment.

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A new hybrid fabrication process for a high sensitivity MEMS microphone

Cited by 9 publications

References 10 publications

A Review of MEMS Capacitive Microphones

A Review of MEMS Capacitive Microphones

An SOI-based post-fabrication process for compliant MEMS devices

Mechanical performance of SiC based MEMS capacitive microphone for ultrasonic detection in harsh environment

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