2014
DOI: 10.1016/j.micpro.2014.04.006
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A new IDDT test approach and its efficiency in covering resistive opens in SRAM arrays

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Cited by 8 publications
(2 citation statements)
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“…Variations in quiescent supply currents have used to detect the faults [18]. Deviations in the transient current are used for the detection of the faults at block level [19]. The detection of bridging defects is discussed [20,21].…”
Section: Introductionmentioning
confidence: 99%
“…Variations in quiescent supply currents have used to detect the faults [18]. Deviations in the transient current are used for the detection of the faults at block level [19]. The detection of bridging defects is discussed [20,21].…”
Section: Introductionmentioning
confidence: 99%
“…Using exhaustive March tests to sensitize faults results in expensive manufacturing tests, as the test cost is directly related to the time each product stays on the tester [13]. Disparate approaches, such as monitoring the static or dynamic current consumption of SRAM cells [14][15][16][17], have been proposed to improve the detection of weak defects. Nevertheless, their efficacy regarding FinFET devices affected by resistive defects is unknown.…”
Section: Introductionmentioning
confidence: 99%