2015
DOI: 10.1016/j.mejo.2014.11.006
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A new MEMS based variable capacitor with wide tunability, high linearity and low actuation voltage

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Cited by 13 publications
(7 citation statements)
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“…Microelectromechanical (MEM) parallel-plates based micro-capacitors have been widely used in communication transceivers [5] owning high tunability because of numerous reasons: the ease of implementation as simple tuning mechanisms, their low area consumption, their high quality factor and straightforwardness in their fabrication. Indeed, there are three major techniques to possibly increase the tunability of parallel-plates micro-capacitors:  Regulation of the electrodes initial gap distance [12][13][14],  Optimization of the effective actuated parallel-plates area [15,16], and  the dielectric displacement method [5,17].…”
Section: Introductionmentioning
confidence: 99%
“…Microelectromechanical (MEM) parallel-plates based micro-capacitors have been widely used in communication transceivers [5] owning high tunability because of numerous reasons: the ease of implementation as simple tuning mechanisms, their low area consumption, their high quality factor and straightforwardness in their fabrication. Indeed, there are three major techniques to possibly increase the tunability of parallel-plates micro-capacitors:  Regulation of the electrodes initial gap distance [12][13][14],  Optimization of the effective actuated parallel-plates area [15,16], and  the dielectric displacement method [5,17].…”
Section: Introductionmentioning
confidence: 99%
“…Due to the nonlinear nature of the electrostatic force applied between the two capacitive electrodes as well as the pull-in instability present in the system, the relative displacement between the electrodes cannot exceed a certain distance. Considerable relative displacements between capacitive electrodes, for example in tunable micro capacitors, is of great importance [13,14].…”
Section: Introductionmentioning
confidence: 99%
“…To achieve this end, some modification implemented in the design and fabrication process of the micro capacitors [2,13,14]. These changes complicated the design and construction process, as well as increased costs.…”
Section: Introductionmentioning
confidence: 99%
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“…Simulating the mechanical behavior of these devices, particularly their static and dynamic behavior, is required for design and manufacturing purposes. Therefore, electrostatically actuated MEM/NEM devices such as, micro switches [1,2] micro-mirrors [3,4], nano-switches [5,6], nano-tweezers [7,8], micro capacitors [9][10][11], sensors [12,13], resonators [14,15] and oscillators [16,17] are widely designed, fabricated, used and analyzed.…”
Section: Introductionmentioning
confidence: 99%