A new method for the dynamic deformation characterization of thin-film stacked structures

Abstract

The dynamic deformation of thin-film stacked structures in the bond pad of microelectronic devices usually occurs when the contact load rapidly increases during the wire-bonding process. This work developed dynamic strain rate model for analyzing the dynamic response of thin-film stacked structures at varying loading rates. Dynamic strain rate tests were performed by maintaining the ratio of instantaneous load rate to load. The indentation stress-strain curves at different testing protocols were plotted. We found that the deformation decreased as the prescribed rate increased because of the rate-dependent characteristics of the thin Cu film.