International Technology and Innovation Conference 2006 (ITIC 2006) 2006
DOI: 10.1049/cp:20061028
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A new micro-EDM reverse copying technology for microelectrode array fabrication

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Cited by 7 publications
(3 citation statements)
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“…This improvement in term of MRR, EWR and dimensional accuracy can be explained by the discharge ratio increment, reduced arcing or short-circuit phenomena, as well as the effect of flushing mechanism [62]. Weiliang et al [63] conducted a similar experimental study to fabricate arrays of microelectrodes and microstructures using UVA-EDM. Their observation suggested increased MRR with the increase of voltage and increased efficiency of two-fold using 20 kHz frequency compared to pure EDM.…”
Section: Research On Ultrasonic Vibration Assisted Edmmentioning
confidence: 99%
“…This improvement in term of MRR, EWR and dimensional accuracy can be explained by the discharge ratio increment, reduced arcing or short-circuit phenomena, as well as the effect of flushing mechanism [62]. Weiliang et al [63] conducted a similar experimental study to fabricate arrays of microelectrodes and microstructures using UVA-EDM. Their observation suggested increased MRR with the increase of voltage and increased efficiency of two-fold using 20 kHz frequency compared to pure EDM.…”
Section: Research On Ultrasonic Vibration Assisted Edmmentioning
confidence: 99%
“…Therefore, many researchers have combined these micro-EDM methods together to realize intricate part fabrication. Micro-protrudes and pits [4], micro array and holes [5,6], and micro turbine [7] have been successively fabricated by combined machining. Although these works show the advantageous of combined micro-EDM, no further study about the combining criterion and machining specification is investigated.…”
Section: Introductionmentioning
confidence: 99%
“…The reverse copying machining mechanism gives a new idea to fabricating microelectrode array by micro-EDM, microelectrode array can be made by reverse copying microhole array to a thicker rod electrode. It can generate intricate features with high aspect ratios and is capable of machining a large variety of conductive materials [4]. In this report, experiments for fabrication of microelectrode arrays and using microelectrode array to machine micro-hole array by ultrasonic enhanced micro-EDM are designed and technology parameters are assessed.…”
Section: Introductionmentioning
confidence: 99%