A New Millimeter-wave Multi-way Power Dividing/Combining Network Based on Waveguide-Microstrip E-plane Dual-Probe Structure

Xie, Xiaogao; Xu, Ruimin; Diao, Rui; Lin, Weigan

doi:10.1109/gsmm.2008.4534616

Cited by 9 publications

(3 citation statements)

References 5 publications

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“…In this paper, based on the conventional Ka-band waveguide E-T branch is made of Ka-band standard waveguide WR-28 (a=7.11mm,b=3.55mm), we present an easy method, show in Fig.1, that halving the height of the main waveguide and adding an additional step at the tie-in for realizing matching in wide frequency band. The optimized S11 of the waveguide E-T branch is below -20dB in 34GHz-40GHz, as shown in Fig.2 [3] [4] . .…”

Section: A Waveguide E-t Branchmentioning

confidence: 99%

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A compact ka-band spatial power combining architecture

Liu

Zhang

Yang

2011

2011 IEEE International Conference on Signal Processing, Communications and Computing (ICSPCC)

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A 2×2 spatial combination structure has been proposed and designed in this paper. It based on two waveguide to mirostrip E-plane dual-probe structures connected with a broadband waveguide E-T branch symmetrically. The measured back-to-back insertion loss of 0.5 dB was achieved with a return loss of 10 dB at 32-37GHz. With convenience of integrating solid-sate high power MMIC devices, this broadband low loss millimeter wave four-way symmetric microstrip integrated power dividing/combining network can realize millimeter solidstate high power combining with a high efficiency.

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Section: A Waveguide E-t Branchmentioning

confidence: 99%

“…Amplitude of S-parameter in dB; (b). Phase of S(2,1) and S(3,1) in degree the TE10 mode of waveguide to quasi-TEM mode of 50Ω microstrip line[3][4] …”

mentioning

confidence: 99%

A compact ka-band spatial power combining architecture

Liu

Zhang

Yang

2011

2011 IEEE International Conference on Signal Processing, Communications and Computing (ICSPCC)

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“…An in phase dual E-plane probe power divider/combiner structure was first presented in [3]. The dual-probe structure consists of two face to face printed microstrip lines separated by an air gap extending into the waveguide.…”

Section: Introductionmentioning

confidence: 99%

Design of a full band, compact waveguide-microstrip power splitter using multilayer PCB technology

Lim

Wei

et al. 2009

2009 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

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This paper presents the simulation results for a new dual-probe structure using multilayer PCB technology that is capable of performing power splitting across the whole of w-band frequency band from 75 GHz to 110 GHz. Existing single probe waveguide-to-microstrip transition design was employed for the new multilayered dual-probe structure, which proved to be effective in waveguide-tomicrostip transition and power splitting. The new one piece multilayered dual-probe structure will provide ease in assembly, improve consistency and lower the manufacturing cost. Simulation results show that the return loss of the waveguide port to be greater than 10 dB and insertion loss better than 0.5 dB across whole w-band.

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