A New Model of Grinding Forces Prediction for Machining Brittle and Hard Materials

Sun, Lin; Yang, Shuming; Yang, Lin; Zhao, Pu; Wu, Pengfei; Jiang, Zhuangde

doi:10.1016/j.procir.2015.04.065

Cited by 24 publications

(7 citation statements)

References 10 publications

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“…where dg is the equivalent spherical diameter of abrasive, 𝜖 is the active fraction of diamond abrasive in the grinding process and the value of 𝜖 is given to be 1/3 [59], 𝛿 is the volume fraction of diamond abrasive in the grinding wheel and the value is 0.375 [60], D is the average height of CeO2 particles distributed along the protruding direction of abrasive, as shown in Fig.…”

Section: The Undeformed Chip Thicknessmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry assisted grinding (SAG) is investigated. A novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SAG. The modelling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SAG was investigated through nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. The CeO2 particle size significantly influenced on the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of ductile-brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SAG of an ellipsoid BK7 optics.

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Section: The Undeformed Chip Thicknessmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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show abstract

“…The grinding wheel in this paper has a concentration density of 150, thus the volume fraction ω is 0.375 (Malkin et al, 1996). Moreover, it is assumed that 1/3 of diamond particle are actively engaged in the grinding process (Sun et al, 2015), which means that χ is 1/3. Therefore, the factual grain number can be calculated through the following equation.…”

Section: Grinding Kineticsmentioning

confidence: 99%

Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

Dong

Zhu³

et al. 2020

JAMDSM

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“…The grinding wheel used in this article has a density of 150, or in other words, volume fraction ω is 0.375. 32 The active grit are assumed that one-third of the total diamond particles are actively engaged in cutting, 33 or the value of χ is equal to 1/3.…”

Section: Theoretical Model For Ductile Grindingmentioning

confidence: 99%

A critical energy model for brittle–ductile transition in grinding considering wheel speed and chip thickness effects

Liang

2016

Proceedings of the Institution of Mechanical Engineers, Part B:

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The ability to predict the critical depth for ductile-mode grinding of brittle materials is important to grinding process optimization and quality control. The traditional models for predicting the critical depth are mainly concerned with the material properties without considering the operation parameters. This article presents a new critical energy model for brittle–ductile transition by considering the strain rate effect brought by the grinding wheel speed and chip thickness. The experiments will be conducted through a high-speed diamond grinder on reaction-sintered silicon carbide materials under different grinding speed and chip thickness. Through detailed analysis of the strain rate effect on the dynamic fracture toughness, a new fracture toughness model will be established based on the Johnson–Holmquist material model (JH-2) and calibrated through experiments based on the indentation fracture mechanics. Then, the new critical model for brittle–ductile transition will be established by introducing the dynamic facture toughness model considering the wheel speed and chip thickness. According to scanning electron microscope observations, the results show that ductile-mode grinding can be obtained through a combination of higher grinding speed and smaller chip thickness. Moreover, the critical value for ductile grinding of brittle materials can be improved through the elevation of the grinding speed or reduction in the chip thickness.

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A New Model of Grinding Forces Prediction for Machining Brittle and Hard Materials

Cited by 24 publications

References 10 publications

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

A critical energy model for brittle–ductile transition in grinding considering wheel speed and chip thickness effects

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