A New Numerical Algorithm to Estimate the Average Travel Time of Workpiece in Packaging Equipments or Reliability Testers

Sun, Niuyi; Yang, Dan; Mei, Na

doi:10.1109/icept59018.2023.10492147

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492147

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A New Numerical Algorithm to Estimate the Average Travel Time of Workpiece in Packaging Equipments or Reliability Testers

Niuyi Sun,

Dan Yang,

Na Mei

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A New Numerical Algorithm to Estimate the Average Travel Time of Workpiece in Packaging Equipments or Reliability Testers

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References 12 publications

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