A new practical inorganic phosphate adhesive applied under both air and argon atmosphere

A SiC whisker reinforced high-temperature resistant phosphate adhesive for bonding carbon/carbon composites

“…Compared to mechanical joining [10], solid reaction diffusion bonding [11,12], brazing [13,14], glass bonding [15,16] and organic precursor bonding [17,18], the inorganic phosphate adhesive bonding is the fastest, cheapest, and most practical joining method, which possesses several superior properties such as room-temperature curing, low-cost production, simple preparation technology and more stable high-temperature resistance [19][20][21]. Its low temperature curing and stable heat-resistant properties make it the promising joining method characterized by ''one-time binding without post-treatment'', thus promoting the processes feasibility, especially when the fabrication and repair of components are needed to be done onsite where the heat treatment is not allowed or not easily carried out [22].…”

Effects of Nano-Aluminum Nitride on the Performance of an Ultrahigh-Temperature Inorganic Phosphate Adhesive Cured at Room Temperature

“…Due to their character of a high melting point, shrinkage polymerization, and excellent bonding strength, Inorganic phosphate adhesives are highly valued and have potential applications in industry. Moreover, they have become more valuable due to their nontoxic, tasteless, nonpolluting characteristics and especially good high-temperature performance used for bonding metals, ceramics, glass, and other materials [ 8 , 9 , 10 , 11 ]. Compared with silicate and organic adhesives, inorganic phosphate adhesives are even able to withstand temperatures of 1300–1700 °C [ 11 , 12 , 13 , 14 ].…”

“…Moreover, they have become more valuable due to their nontoxic, tasteless, nonpolluting characteristics and especially good high-temperature performance used for bonding metals, ceramics, glass, and other materials [ 8 , 9 , 10 , 11 ]. Compared with silicate and organic adhesives, inorganic phosphate adhesives are even able to withstand temperatures of 1300–1700 °C [ 11 , 12 , 13 , 14 ]. For large bonding structures, this is obligatory for the adhesive cured at room temperature [ 15 , 16 , 17 , 18 ].…”

Polyborosilazane preceramic as matrix resin of high temperature adhesive for graphite bonding

“…To our knowledge, there is no report about preceramic as heat‐resistant adhesive. In the past, the use of preceramic for joining engineering materials (e.g., ceramic, carbon, and composite material) for high temperature applications is mainly focused on the characteristics of the pyrolytic ceramic, which has matched coefficient of thermal expansion with matrix material, to realize the high temperature connection between the ceramic matrices . However, there is no concern about the bonding property of precursor polymer before it converted into ceramic.…”

“…In the past, the use of preceramic for joining engineering materials (e.g., ceramic, carbon, and composite material) for high temperature applications is mainly focused on the characteristics of the pyrolytic ceramic, which has matched coefficient of thermal expansion with matrix material, to realize the high temperature connection between the ceramic matrices. [3][4][5][6][7][8][9][10][11][12][13][14][15][16] However, there is no concern about the bonding property of precursor polymer before it converted into ceramic. Thus, it is not an adhesive in a strict sense and the needed high treatment temperature and pressure during joining process limits its wide application.…”