“…Since the failure mechanism in these systems often involves spallation of the ceramic coating from the metallic substrate, it is important to prepare cross-sectional thin films of the ceramic-metal interface for transmission electron microscopy (TEM) in order to relate service performance of the coatings with phase distribution and microstructure in this region. The preparation of cross-sectional specimens for TEM has been described previously on several occasions (Abraham and Buicchi, 1974;Bravman and Sinclair, 1984;Doychak, 1989;Flutie, 1986;Shen and Marcus, 1980;Wetzel, 19891, particularly for systems involving semiconductor substrates. The basic procedure involves joining several interfaces by means of a suitable epoxy and slicing this resulting composite with a saw to obtain a cross-sectional thin film.…”