2017 IEEE International Electron Devices Meeting (IEDM) 2017
DOI: 10.1109/iedm.2017.8268454
|View full text |Cite
|
Sign up to set email alerts
|

A novel 25 Gbps electro-optic Pockels modulator integrated on an advanced Si photonic platform

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

4
22
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
9

Relationship

0
9

Authors

Journals

citations
Cited by 24 publications
(26 citation statements)
references
References 13 publications
4
22
0
Order By: Relevance
“…Power confinement in the BTO scales with BTO thickness and can therefore be increased by fabricating devices with thicker BTO layers (Supporting Information Section 2). The propagation losses are 9.4 dB/cm (Supporting Information Section 3), comparable to previous reports of hybrid BTO−silicon waveguides, 39,42,45 and can likely be reduced through the development of an optimized fabrication process. 16,42 Racetrack resonators used for index tuning experiments feature two 75-μm-long straight segments with electrodes separated by 5.1 μm to apply an electric field for electro-optic operation (Figure 1d).…”
supporting
confidence: 83%
“…Power confinement in the BTO scales with BTO thickness and can therefore be increased by fabricating devices with thicker BTO layers (Supporting Information Section 2). The propagation losses are 9.4 dB/cm (Supporting Information Section 3), comparable to previous reports of hybrid BTO−silicon waveguides, 39,42,45 and can likely be reduced through the development of an optimized fabrication process. 16,42 Racetrack resonators used for index tuning experiments feature two 75-μm-long straight segments with electrodes separated by 5.1 μm to apply an electric field for electro-optic operation (Figure 1d).…”
supporting
confidence: 83%
“…Our concept of high-speed transceivers relies on the monolithic integration of BTO thin films via direct wafer bonding above an interlayer dielectric (ILD) in a standard EPIC flow ( Fig. 1(a)) [16]. The bonding step can be performed on top of any ILD above the front-end-of-line (FEOL) structures.…”
Section: Technology Conceptmentioning
confidence: 99%
“…Its largest Pockels tensor element is reported to be r 42 = 1300 pm/V in the unclamped, zero-stress case, and to be r 42 = 700 pm/V in the clamped case [19]. The Pockels effect of BTO has already been exploited in active Si photonic devices [20]- [24] and [53], since BTO can be epitaxially grown on Si [20]. Recently, EO modulators based on BTO have even been monolithically integrated on an advanced Si photonic platform, opening up possibilities towards monolithic integration with electric circuits in a foundry environment [24].…”
mentioning
confidence: 99%