2019
DOI: 10.1007/s00170-019-04573-6
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A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process

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Cited by 11 publications
(6 citation statements)
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“…The trends of bump pitch depended on the critical contact angle. For contact angle lower than its critical value, the filling time increases with pitch; otherwise, the filling time increases with the decrease of pitch [31].…”
Section: Discussionmentioning
confidence: 94%
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“…The trends of bump pitch depended on the critical contact angle. For contact angle lower than its critical value, the filling time increases with pitch; otherwise, the filling time increases with the decrease of pitch [31].…”
Section: Discussionmentioning
confidence: 94%
“…Furthermore, most researches adopted at least two methods, with the most common pair being simulation and experiment. Numerical simulation is the most applied method, The filling time increases significantly if the bump pitch is less than a critical value of pitch size [31,80]. The trends of bump pitch depended on the critical contact angle.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Subsequently, Figure 4 gave another comparison between the filling progressions that obtained from current numerical simulation with that obtained from the regional segregation based analytical filling time model [17][18][19][20]. On the general trending, both simulation and analytical models predicted the filling progression as a monotonically increasing curve, that is indicated by the gradually increasing flow of underfill fluid to the flip-chip domain.…”
Section: Validation With Analytical Filling Time Modelmentioning
confidence: 86%
“…Generally, the filling time of underfill process was determined either by direct experimental measurement (Han and Wang, 1997;Wan et al, 2008;Lee et al, 2010;Kim et al, 2011), through numerical simulation (Wan et al, 2009;Khor et al, 2010;Ng et al, 2017;Ng et al, 2019b) or through computation using analytical filling time model (Young, 2003;Young, 2004;Wan et al, 2005;Yao et al, 2014a;Luo et al, 2016;Ng et al, 2019a). Nonetheless, the former two have more applications in the underfill researches upon being more straightforward, whereas the later analytical filling time models are limited in number because of the complexity of the underfill flow mathematical modelling (Ng et al, 2019c). Han and Wang (1997) applied the Washburn equation as the first analytical filling time model to validate their experimental findings.…”
Section: Introductionmentioning
confidence: 99%