2022
DOI: 10.1016/j.mtcomm.2022.103356
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A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure

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Cited by 9 publications
(4 citation statements)
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“…Even with the low cooling rate (0.083 °C/s) utilized for heating and cooling in the DSC, there are some differences in the transition temperatures compared to the equilibrium diagram produced by the Thermo-Calc. Furthermore, the endothermic and exothermic peak positions are not entirely symmetrical because subcooling of the particles during the solidification process may cause them to shift …”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Even with the low cooling rate (0.083 °C/s) utilized for heating and cooling in the DSC, there are some differences in the transition temperatures compared to the equilibrium diagram produced by the Thermo-Calc. Furthermore, the endothermic and exothermic peak positions are not entirely symmetrical because subcooling of the particles during the solidification process may cause them to shift …”
Section: Resultsmentioning
confidence: 99%
“…Furthermore, the endothermic and exothermic peak positions are not entirely symmetrical because subcooling of the particles during the solidification process may cause them to shift. 25 Figure 5 shows the differential scanning calorimetry results of the Sn−Ni−Zn alloys. The endothermic curves displayed the temperatures of 225.7 and 231, and 225.6 and 231.2 °C, for the Sn-0.2 wt % Ni-0.2 wt % Zn and Sn-0.2 wt % Ni-0.5 wt % Zn solder alloys, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…To harness the endless possibilities of such third-generation electronics, there is a pressing need for advanced packaging materials capable of withstanding demanding operational conditions, including elevated temperatures resulting from increased power density and component miniaturization. Transient Liquid Phase (TLP) bonding is one potential approach for creating reliable interconnections [3]. The introduction of a lower melting point metal interlayer allows bonding via diffusion processes and the creation of intermetallic compounds (IMCs) with higher melting points.…”
Section: Introductionmentioning
confidence: 99%
“…Thorough stirring is required before use if the paste brazing material shows signs of stratification. The performance of the brazing material significantly influence the quality of the brazed joint [10][11][12][13] . In this study, Al-Si-Cu-Ni low melting point brazing materials were prepared into material powders with suitable particle size using nitrogen atomization technology.…”
mentioning
confidence: 99%