A novel application of acrylic resin UV-Curing methodology for radioactive surface decontamination

The arrival of the 5G era requires that the solder resist coating of electronic chips involved in high-frequency communication technology has more promising comprehensive properties, including strong mechanical properties, high heat resistance, and voltage breakdown resistance. Herein, an efficient method was proposed to modify bisphenol A diglycidyl ether (DGEBA) with various diamine chain extenders, and five representative chain-extended DGEBA epoxy resins were constructed by introducing aliphatic and aromatic segments. On this basis, the epoxy-terminated resins were reacted with acrylic acid (AA) and then with tetrahydrophthalic anhydride (THPA) to produce photocurable resin with alkaline development. Owing to the high reactivity of amino groups, chain extension with diamines possesses the characteristics of a fast reaction under relatively mild conditions. The characteristic molecular structures (various numbers of rigid benzene rings or flexible aliphatic chains bonded with different numbers of ethers) of diamine profoundly affect the mechanical/thermal properties of the prepared UV-cured resins. The chain extension strategy is the key to striking a balance between high heat resistance and robust mechanical properties for traditional epoxy resins. The optimal UV-cured TPER-modified (P-BA) film manifests superior elongation at break (8.6%), robust toughness (4.1 MJ cm–3), and high heat resistance (T g = 141.8 °C). Furthermore, the practical application of the modified resin as the customized pattern of the solder resist coating was demonstrated, which is expected to provide important guiding significance for improving the multifunctional bisphenol A UV-curable epoxy resin.

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Synthesis and Characterization of High-Performance UV-Curable Resins Derived from Propylene Carbonate

Jiang,

Chen,

Zou

et al. 2024

ACS Appl. Polym. Mater.

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Diols (PCD and IPCD) were synthesized by the reaction of propylene carbonate (PC) with ethylenediamine (EDA) or 2-methyl-1,5-pentanediamine (DAMP), respectively, and the diols were then reacted with isophorone diisocyanate (IPDI), and finally were terminated with hydroxyethyl acrylate (HEA) to obtain ultraviolet (UV)-curable oligomers (HPD and HDPD). The chemical structures of the oligomers were analyzed by Fourier transform infrared spectroscopy (FT-IR) and nuclear magnetic resonance ( 1 H NMR). The two oligomers were separately mixed with the diluent tetrahydrofuran acrylate (THFA) and the photoinitiator ethyl (2,4,6-trimethylbenzoyl) phenylphosphonate (TPO-L) to form homogeneous mixtures. The UV-curing reaction of the mixtures was carried out under UV light intensity of 120 mW/cm 2 , and the unsaturation conversion was monitored by real-time infrared spectroscopy (real-time FT-IR). The thermal stability of UV-cured product was analyzed, and the mechanical properties, surface properties, and three-dimensional (3D)-printed samples of the UV-cured HPD and HDPD were compared with those of UV-cured bisphenol A-type epoxy acrylate (EA). The results showed that UV-cured HPD and HDPD had excellent heat resistance. Compared to UV-cured EA, UV-cured HPD and HDPD exhibited higher tensile strength and flexibility and better transparency and surface properties.

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A novel application of acrylic resin UV-Curing methodology for radioactive surface decontamination

Cited by 3 publications

References 9 publications

Tough strippable hydrogel films based on acrylic acid/acrylamide/zirconyl chloride for surface radioactive decontamination at low temperatures

Tough strippable hydrogel films based on acrylic acid/acrylamide/zirconyl chloride for surface radioactive decontamination at low temperatures

Photo-Cross-Linked Acrylate Resins Enabled by Tuning Various Flexible Diamine-Extended Species for High-Performance Printed Circuit Board Coatings

Synthesis and Characterization of High-Performance UV-Curable Resins Derived from Propylene Carbonate

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