2022
DOI: 10.1080/10426914.2022.2030873
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A novel approach to dissimilar joining of AA7075 to AZ31B by friction stir soldering using Sn intermediate layer

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Cited by 5 publications
(1 citation statement)
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“…In dissimilar joining, the IMC layer acts as the site for fracture initiation and propagation and causes brittle damage [27]. Depending on the process and geometry, the distribution of the IMC layer can vary along the interface of dissimilar materials [28]. The mechanisms of joining and IMC formation in T-jointing of dissimilar materials are still not well studied, and there are few publications on this subject, some of which had been mentioned in the previous paragraph.…”
Section: Introductionmentioning
confidence: 99%
“…In dissimilar joining, the IMC layer acts as the site for fracture initiation and propagation and causes brittle damage [27]. Depending on the process and geometry, the distribution of the IMC layer can vary along the interface of dissimilar materials [28]. The mechanisms of joining and IMC formation in T-jointing of dissimilar materials are still not well studied, and there are few publications on this subject, some of which had been mentioned in the previous paragraph.…”
Section: Introductionmentioning
confidence: 99%