Electrical Performance of Electronic Packaging
DOI: 10.1109/epep.1997.634070
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A novel broadband flip chip interconnection

Abstract: Flip chip interconnections with CPW structures are studied. A novel broadband flip chip interconnection design is proposed based on the results of thc sensitivity analysis performed by the Finite Difference Time Domain (FDTD) method.

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Cited by 3 publications
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“…5(b). However, this performance degeneration is anticipated from the fact that the usual return loss of a single flip-chip interconnect is around 10-20dB at 5-20GHz [7]. CONCLUSION A novel microstrip-to-CPW transition without via connection is proposed and its application to microstrip-to-flip-chip interconnection is studied.…”
Section: Numerical and Measurement Resultsmentioning
confidence: 99%
“…5(b). However, this performance degeneration is anticipated from the fact that the usual return loss of a single flip-chip interconnect is around 10-20dB at 5-20GHz [7]. CONCLUSION A novel microstrip-to-CPW transition without via connection is proposed and its application to microstrip-to-flip-chip interconnection is studied.…”
Section: Numerical and Measurement Resultsmentioning
confidence: 99%