A Novel CMOS Image Sensor Package Cover Glass White Stain Material Identification Metrology by TOF-SIMS

Kee, Yeh Yee; Sek, Kei Lin; Zhu, Liangqing; Hua, Younan; Li, Xiaomin

doi:10.1109/ipfa53173.2021.9617289

Cited by 3 publications

(3 citation statements)

References 2 publications

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“…Furthermore, outgassing and bleeding of any kind are not acceptable [2]. All components that settle in the sensor in form of precipitation are an unacceptable problem.…”

Section: Figure 1: Delo Image Sensor Illustration a Defining The Chal...mentioning

confidence: 99%

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Adhesive Solutions for Closed Cavity Packaging

Schirmer,

Ringelstetter

2024

IMAPSource Proceedings

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The trend towards autonomous driving demands continuously increasing safety requirements and hence reliable components such as CMOS image sensors or communication devices. To provide such components, manufactures are facing ever greater challenges as the sensor packages need to be airtight-sealed over its whole lifetime. Typical defects that can be observed when using conventional lid attach materials for closed cavity packages in tests at automotive level (e.g., according to AEC Q100) are pop-up effects and delamination. To avoid these defects and to meet the increasing reliability requirements of the semiconductor industry, DELO Industrial Adhesives has developed special adhesives that not only ensure reliable bonding while keeping narrow and high bondlines, but also improve process stability. The required adhesive properties were defined by an FE analysis model. To test suitability of the new developments, dummy image sensor packages were built up, which passed through the testing of the bearing, according to AEC Q 100 standard. Finally, the tightness of the bondline was checked via microscope and other methods. Features such as light/heat B-stage or light fixation help to keep the attached lid in place during heat curing and other subsequent steps like temperature cycling, humidity storage or reflow.

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“…Furthermore, outgassing and bleeding of any kind are not acceptable [2]. All components that settle in the sensor in form of precipitation are an unacceptable problem.…”

Section: Figure 1: Delo Image Sensor Illustration a Defining The Chal...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Adhesive Solutions for Closed Cavity Packaging

Schirmer,

Ringelstetter

2024

IMAPSource Proceedings

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“…The main challenge is to compensate the changing pressures inside the cavity while keeping the cavity airtight. In addition, outgassing must be reduced to a minimum to avoid contamination of other components inside the package [2]. When working on "Lid Attach onto Housing applications", as shown in Figure 1, the same defect patterns often occur.…”

mentioning

confidence: 99%

Adhesive Solutions for Closed Cavity Packaging

Schirmer,

Ringelstetter

2024

IMAPSource Proceedings

View full text Add to dashboard Cite

The trend towards autonomous driving demands continuously increasing safety requirements and hence reliable components such as CMOS image sensors or communication devices. To provide such components, manufactures are facing ever greater challenges as the sensor packages need to be airtight sealed over their whole lifetime. Typical defects that can be observed when using conventional lid attach materials for closed cavity packages in tests at automotive level (e.g., according to AEC Q100) are pop-up effects and delamination. To avoid these defects and to meet the increasing reliability requirements of the semiconductor industry, DELO Industrial Adhesives has developed special adhesives that not only ensure reliable bonding while keeping narrow and high bondlines, but also improve process stability. Features such as light/heat B-stage or light fixation help to keep the attached lid in place during heat curing and other subsequent steps like temperature cycling, humidity storage and even reflow.

show abstract

Adhesive Solutions for Closed Cavity Packaging

Schirmer,

Ringelstetter

2023

2023 24th European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)

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A Novel CMOS Image Sensor Package Cover Glass White Stain Material Identification Metrology by TOF-SIMS

Cited by 3 publications

References 2 publications

Adhesive Solutions for Closed Cavity Packaging

Adhesive Solutions for Closed Cavity Packaging

Adhesive Solutions for Closed Cavity Packaging

Adhesive Solutions for Closed Cavity Packaging

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