A novel defect detection technique using active transient thermography for high density package and interconnections

Chai, Taichong; Wongi, B.S.; Bai, Wei; Trigg, A. D.; Lain, Yi-Wei

doi:10.1109/ectc.2003.1216400

Cited by 18 publications

(13 citation statements)

References 3 publications

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“…Thermal profiles have been obtained and used to characterize interconnects in electronics by mean of infrared imaging [40,[50][51][52][53][54]. Boguslaw et al [50] used a thermographic camera to characterize solder thickness on printed circuit boards based on thermal transient response; thermal transient response was found to vary with solder thickness as a consequence of thermal conductivity and capacity.…”

Section: Introductionmentioning

confidence: 99%

“…Boguslaw et al [50] used a thermographic camera to characterize solder thickness on printed circuit boards based on thermal transient response; thermal transient response was found to vary with solder thickness as a consequence of thermal conductivity and capacity. Chai et al [51] were able to detect solder joint cracks in flip chip packages by mean of infrared thermal imaging; the solder cracks were detected as clear high temperature areas in the thermal images caused by an increase in thermal resistance. King et al [52] showed anomalous temperature spots in infrared images of photovoltaic systems; these anomalous temperatures were due to resistive or failed solder bonds, short circuits, resistive battery terminals, and shunts.…”

Section: Introductionmentioning

confidence: 99%

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Finite element analysis and neural network model for electronic hidden solder joint geometry prediction

Palomares

Hsieh

2010

SPIE Proceedings

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This paper investigates an active thermography approach to probing hidden solder joint geometry. Ten boards were fabricated with the same number of solder joints and amount of solder paste (0.061 g), but using three solder joint geometries (60°, 90°, and 120°). The 90° angle solder pin represented a normal joint, and the 60° and 120° angle pins represented abnormal solder joints. Each board was covered with another board that had three openings just big enough to allow the pin terminals to protrude. A semi-automated system was built to heat and then transfer each board set to a chamber where an infrared camera was used to scan the board as it was cooling down. Each board set underwent the heating, cooling, and scanning process for five trials. Two-thirds of the data set was used for model development and one-third for model evaluation. An artificial neural network (ANN) was constructed to predict abnormal joints given thermal data. Results suggest that solder joints with more surface area cool much faster than those with less surface area. A Finite Element Analysis (FEA) of the heating up and cooling down process consistently predicted solder geometry using the ANN with 86% accuracy. This approach can be used not only to inspect bad solder joints (i.e., low reliability) but also to mass screen for cold solder joints during BGA assembly, since the air gaps in cold solder joints may cause them to cool more slowly than normal joints.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Finite element analysis and neural network model for electronic hidden solder joint geometry prediction

Palomares

Hsieh

2010

SPIE Proceedings

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“…Although SEM has a very high resolution for profiling the solder bump, it is only confined to the research and development stages for the reason of destructive and inefficient [12,13]. Chai et al utilized active transient thermography to detect solder bump defects by passing electrical current through a potential defective interconnection in a daisy chained package, based on the principle that the increase in electrical resistance indicated the existence of defects [14]. Yang and Ume proposed a plate and spring model as the flip chip analytical model and developed a laser ultrasound-interferometry system for solder bump inspection [15,16].…”

Section: Introductionmentioning

confidence: 99%

Detection of solder bump defects on a flip chip using vibration analysis

et al. 2012

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Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an aircoupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.

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“…Zhang et al developed a laser ultrasound inspection system to investigate the solder joint cracks induced by thermal cycling [12]. Chai et al utilized active transient thermography to detect voids and partial cracks in solder joints by passing electric currents through a potential defective interconnection in a daisy-chain package [13]. Lu et al proposed a thermal inspection method based on the pulsed phase thermography for identification of missing solder joints [14].…”

Section: Introductionmentioning

confidence: 99%