A Novel Electrodeposited Ni-Cr-Al Nanocomposite with Improved Oxidation Resistance

Yang, Xiulin; Xiao, Peng; Wang, Fu Hui

doi:10.4028/www.scientific.net/amr.472-475.137

Cited by 1 publication

(1 citation statement)

References 25 publications

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“…Yang et al, has fabricated a novel Ni-3Cr-10Al nanocomposite by co-electrodeposition of Ni with Cr and Al nanoparticles [17]. As referring to the oxidation kinetic of alloy and nanocomposited Ni-3Cr-10Al, it was found that the oxidation rate of the Ni-3Cr-10Al nanocomposite oxidized in air at 900°C was very much lowered to its unique structure that composed of nano-sized Ni matrix and consistently dispersed Cr and Al nanoparticles compared to the conventional Ni-3Cr-10Al alloy.…”

Section: Electrodeposition Methods On Enhancing the Solder Reliabilitymentioning

confidence: 99%

Electrodeposition as an Alternative Route to Prepare Nanostructured Lead-Free Solder Alloy: A Short Review

Yusof

Hashim

Jai

et al. 2015

AMR

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With world-wide strict legislation for reduction or removal of lead from industrial waste, development of a large number of lead-free alternative solder materials had been intensively examined. The drive for lead-free solders development was towards systems that can imitate conventional lead containing solder alloys in terms of melting temperatures and improvement of mechanical properties. Nanostructured solder alloy, with a grain size of typically < 100 nm, was a new class of materials with properties distinct from and frequently distinguished to those of the conventional alloy. In comparison, nanostructured solder alloys exhibit higher strength and hardness, enhanced diffusivity, and excellent soft and hard magnetic properties. Numerous different techniques were performed to synthesize these nanostructured solder alloys. Electrodeposition method has generated huge interest in nanostructured solder preparation, mainly due to its ability to deposit solders selectively and uniformly at nanoscale. These factors bring significant influences on the behaviors of products, such as magnetization, density, ductility, wear resistance, corrosion resistance, porosity, molecular structure, and crystal properties which plays a vital part in the field of electronic manufacturing. In this paper, a short review on the electrodeposition, a useful technique to deposit different metals and alloys, as a method for nanostructured lead-free solder alloys preparation is presented.

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Section: Electrodeposition Methods On Enhancing the Solder Reliabilitymentioning

confidence: 99%

Electrodeposition as an Alternative Route to Prepare Nanostructured Lead-Free Solder Alloy: A Short Review

Yusof

Hashim

Jai

et al. 2015

AMR

View full text Add to dashboard Cite

show abstract

A Novel Electrodeposited Ni-Cr-Al Nanocomposite with Improved Oxidation Resistance

Cited by 1 publication

References 25 publications

Electrodeposition as an Alternative Route to Prepare Nanostructured Lead-Free Solder Alloy: A Short Review

Electrodeposition as an Alternative Route to Prepare Nanostructured Lead-Free Solder Alloy: A Short Review

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