A Novel Electromagnetic Bandgap Structure for SSN Suppression in PWR/GND plane pairs

Scogna, Antonio Ciccomancini; Schauer, Martin

doi:10.1109/ectc.2007.373947

Cited by 14 publications

(5 citation statements)

References 8 publications

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“…The concept of using Electromagnetic bandgap (EBG) structures embedded between the parallel plates has shown to provide excellent suppression of noise at GHz frequencies. This idea was inspired by the high impedance surface (HIS/EBG) [1-2] in the form of mush room EBG and same concept is extended to pattern the power plane, as a periodic planar EBG [3]. Compact wireless devices demand stop band due to the EBG structure with a small patch (unit cell).…”

Section: Introductionmentioning

confidence: 99%

Compact Electromagnetic Bandgap structure for noise suppression in power plane

Patnam

Karunakaran

Swaminathan

2008

2008 Electrical Design of Advanced Packaging and Systems Symposium

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A compact reduced size new Electromagnetic Bandgap (EBG) structure with the combination of AIEBG and multiple narrow slits in power plane is presented. Low on-set frequency is realized by concatenating 2x2 high frequency unit cells into a low frequency EBG unit cell without changing the over all dimensions of the EBG. Newly designed EBG operates over a frequency band of 0.9 GHz to 3.5 GHz with a good isolation of better than -40 dB over the band with 2x2 unitcells. The impedance of the structure is also presented, which is less than one ohm over the stop band of the EBG. Both the simulation and the measured results are compared and presented.

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Section: Introductionmentioning

confidence: 99%

Compact Electromagnetic Bandgap structure for noise suppression in power plane

Patnam

Karunakaran

Swaminathan

2008

2008 Electrical Design of Advanced Packaging and Systems Symposium

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“…Prior to this work, power delivery network (PDN) with electromagnetic band gap (EBG) was considered to be a promising noise suppression technology [4][5][6][7]. To reduce the physical size and improve the performance of EBG structure, high dielectric constant embedded capacitor thin film material had also been employed [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

“…In such a compact SOP approach, digital IC are placed extremely close to RF IC to reduce the package size, and then electromagnetic interference (EMI) and simultaneous switching noise from the digital IC will certainly interfere with the RF operation [3]. How to suppress the noise propagation is becoming one of major challenges for SOP design.Prior to this work, power delivery network (PDN) with electromagnetic band gap (EBG) was considered to be a promising noise suppression technology [4][5][6][7]. To reduce the physical size and improve the performance of EBG structure, high dielectric constant embedded capacitor thin film material had also been employed [8][9][10].…”

mentioning

confidence: 99%

Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitor

Wang

Wan

et al. 2009

2009 11th Electronics Packaging Technology Conference

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System on package (SOP) is an emerging technology, and provides an implementation options for system with small size, especially for mixed-signal systems. However, in such a compact package, noise generated by the digital chip can be easily coupled to the RF IC, and degrade the sensitivity of RF signal. In this paper, a simple and efficient multi-order lowpass filter for EMI and SSN suppression in system on package is implemented with embedded capacitor material. It has good performance in noise isolation with a small size of 10mm*mm. The lowpass filter is designed and simulated by electromagnetic analysis software, HFSS. The insertion loss is below -70dB from1.5GHz to 10GHz. Then, the lowpass filter is serial with a surface mounted 47nH inductor, and can achieve noise suppression below-50dB from 50MHz to 10GHz, below -60dB from 140MHz to 10GHz, and below80dB from 600MHz to 10GHz. That is very promising for system on package application in mixed-signal systems. The structure can also be used in large scale backplanes or motherboards. IntroductionConsumer electronics market demands for smaller size, lower cost, and higher level of integration have continued to drive the electronic systems to be convergent, and system on package (SOP) become an encouraging solution to improve circuit performance and reduce the system real estate [1]. SOP is more than an IC package containing multiple die, and seeks to integrate multiple system functions into one compact, lightweight, thin-profile, low cost, high performance packaged system [2]. The system design may include RF and wireless devices (such as power amplifiers, switch/filter modules, GPS modules, Bluetooth modules), digital baseband solutions and controllers. In such a compact SOP approach, digital IC are placed extremely close to RF IC to reduce the package size, and then electromagnetic interference (EMI) and simultaneous switching noise from the digital IC will certainly interfere with the RF operation [3]. How to suppress the noise propagation is becoming one of major challenges for SOP design.Prior to this work, power delivery network (PDN) with electromagnetic band gap (EBG) was considered to be a promising noise suppression technology [4][5][6][7]. To reduce the physical size and improve the performance of EBG structure, high dielectric constant embedded capacitor thin film material had also been employed [8][9][10]. But Most EBG structures had been developed for large scale backplane or motherboard applications [11][12][13][14][15]. Of course, some researchers had presented a few EBG solutions for packages. E. Song et al. had presented a spiral-patch EBG for < 5GHz SSN suppression in mixed-signal SIP [16]. J. Park had utilized a double-stacked EBG structure for 11.4 GHz noise stop bandwidth with -30dB suppression in SIP applications [17].But all of these EBG structures have severe disadvantages that limit their applications in productions. For example, the EBG structures are usually very complicated for fabrication, and the performances are sensitive to the siz...

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“…The concept of using Electromagnetic bandgap (EBG) structures embedded between the parallel plates has shown to provide excellent suppression of noise at GHz frequencies. This idea was inspired by the high impedance surface (HIS/EBG) [2][3] in the form of mushroom EBG and same concept is extended to pattern the power plane, as a periodic planar EBG [4]. Compact communication devices demand EBG structure with a small unitcell.…”

Section: Introductionmentioning

confidence: 99%

A novel Electromagnetic Bandgap power plane with low radiation and wideband noise suppression

Rao

Sreenivasan

Sreekumar

2009

2009 Applied Electromagnetics Conference (AEMC)

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A compact reduced size new Electromagnetic Bandgap (EBG) structure with multiple narrow slits unitcell in power plane is presented. By concatenating 2 x 2 high frequency unitcells a virtual low frequency EBG unitcell is created without changing the over all dimensions of the EBG making a compact design. Newly designed EBG operates over a frequency band of 0.9 GHz to 3.5 GHz with a good isolation of better than -40 dB over the band. The proposed design suppresses radiated emission (or electromagnetic interference) with in the stop-band. Emission characterisation has been carried out for both vertical and horizontally polarised signals and radiated emission of the new EBG is found to be small when compared with solid power/ground planes. Measured characteristics demonstrated a low emission from the EBG with an average value of 35dBuV/m. New EBG structure also exhibits low impedance which is less than one ohm over the stop-band for efficient prime power transfer.

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A Novel Electromagnetic Bandgap Structure for SSN Suppression in PWR/GND plane pairs

Cited by 14 publications

References 8 publications

Compact Electromagnetic Bandgap structure for noise suppression in power plane

Compact Electromagnetic Bandgap structure for noise suppression in power plane

Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitor

A novel Electromagnetic Bandgap power plane with low radiation and wideband noise suppression

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