A novel energy-efficient scheduling model for multi-core systems

Kumar, Neetesh; Vidyarthi, Deo Prakash

doi:10.1007/s10586-020-03143-w

Cited by 18 publications

(5 citation statements)

References 39 publications

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“…Power consumption is one of the major problems faced in the high-performance microprocessor industry [14,35,50]. The need for an increase in performance has steered the operating frequencies higher, resulting in an increased complexity among the microprocessor designs [29,30,50]. Fig.…”

Section: Introductionmentioning

confidence: 99%

Design Automation of Series Resonance Clocking in 14-nm FinFETs

Challagundla,

Bezzam,

Islam

2023

Circuits Syst Signal Process

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Power-performance constraints have been the key driving force that motivated the microprocessor industry to bring unique design techniques in the past two decades. The rising demand for high-performance microprocessors increases the circuit complexity and data transfer rate, resulting in higher power consumption. This work proposes a set of energy recycling resonant pulsed flip-flops to reuse some of the dissipated energy using series inductor-capacitor (LC) resonance. Moreover, this work also presents wideband clocking architectures that use series LC resonance and an inductor tuning technique. By employing pulsed resonance, the switching power dissipated is recycled back. The inductor tuning technique aids in reducing the skew, increasing the robustness of the clock networks. This new resonant clocking architecture saves over 43% power and 90% reduced skew in clock tree networks and saves 44% power and 90% reduced skew in clock mesh networks, clocking a range of 1-5 GHz frequency, compared to conventional primary-secondary flip-flop-based clock networks. Implementation of resonant clock architectures on standard clock network benchmarks depicts 66% power Dhandeep Challagundla

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Section: Introductionmentioning

confidence: 99%

Design Automation of Series Resonance Clocking in 14-nm FinFETs

Challagundla,

Bezzam,

Islam

2023

Circuits Syst Signal Process

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“…Power consumption is one of the major problems faced in the high-performance microprocessor industry [1]- [3]. The need for an increase in performance has steered the operating frequencies higher, resulting in an increased complexity among the microprocessor designs [2], [4], [5]. This higher power led designers to constantly come up with innovative techniques to reduce the power while trying to meet all the design constraints that impact the performance [6]- [9].…”

Section: Introductionmentioning

confidence: 99%

Power and Skew Reduction Using Resonant Energy Recycling in 14-nm FinFET Clocks

Challagundla¹,

Mehedi²,

Bezzam³

et al. 2022

Preprint

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As the demand for high-performance microprocessors increases, the circuit complexity and the rate of data transfer increases resulting in higher power consumption. We propose a clocking architecture that uses a series LC resonance and inductor matching technique to address this bottleneck. By employing pulsed resonance, the switching power dissipated is recycled back. The inductor matching technique aids in reducing the skew, increasing the robustness of the clock network. This new resonant architecture saves over 43% power and 91% skew clocking a range of 1-5 GHz, compared to a conventional primary-secondary flip-flop-based CMOS architecture.

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“…Based on the first law of thermodynamics, the internal energy of a stationary system will be increasing if the net energy entering the system is positive, and as a result, the temperature of the system will be getting high. An electronic component could overheat due to high power and/or poor heat dissipation, causing various problems on efficiency, reliability, performance, and so on [1][2][3][4]. Two common strategies for thermal management of an electronic component are reducing electrical work input (power consumption) and removing thermal energy out of the system.…”

Section: Introductionmentioning

confidence: 99%

Recent Developments in Air Pumps for Thermal Management of Electronics

Wen

2021

Journal of Electronic Packaging

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For electronics, poor thermal management could cause severe mechanical and electrical failures. Forced convective air cooling, i.e., flowing air over a hot surface, is one of the most efficient and economical solutions to manage thermal issues of electronics. Air pump is used to initiate and sustain airflow required in forced convection. This paper reviews both the mechanical and the nonmechanical air pumps that have been using widely in current electronics or have a great potential in future electronics. The mechanical pumps include axial fans, blowers, beam fans, and diaphragm pumps, while the nonmechanical pump specifically focuses on electrohydrodynamic pumps. This paper presents the working principle first and then the recent developments, including the pump itself (design, characteristics, etc.) and the applications in thermal management (placement, integration, etc.). In the end, this paper conducts the strength analysis (flow rate, pressure, noise, flexibility, and reliability) among the reviewed five types of air pumps.

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A novel energy-efficient scheduling model for multi-core systems

Cited by 18 publications

References 39 publications

Design Automation of Series Resonance Clocking in 14-nm FinFETs

Design Automation of Series Resonance Clocking in 14-nm FinFETs

Power and Skew Reduction Using Resonant Energy Recycling in 14-nm FinFET Clocks

Recent Developments in Air Pumps for Thermal Management of Electronics

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