A novel intelligent textile technology based on silicon flexible skins

Katragadda, R.B.; Xu, Yong

doi:10.1109/iswc.2005.5

Cited by 16 publications

(14 citation statements)

References 15 publications

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“…Another application of WFS is as sensing of glucose via secretion mediums like a tear (Iguchi et al 2007) and immobilization of glucose oxidase (Kudo et al 2006;Kwak et al 2012). Electronic skins or e-skins (Katragadda and Xu 2008;Wang et al 2014a) are another significant areas which was worked upon to mimic the functions of a natural skin in determining the changes in temperature, pressure or health conditions of a person at a specific time. These sensors (Bauer 2013) are embedded in thermal actuators and organic displays.…”

Section: Types Of Activity Monitoring With Wearable Flexible Sensorsmentioning

confidence: 99%

Literature Review

Nag¹,

Mukhopadhyay²,

Kosel³

2019

Printed Flexible Sensors

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This chapter elucidates on some of the work done by different researchers on sensors developed from Carbon Nanotubes (CNTs) and graphene. Work done on the preparation and properties of CNTs and graphene are explained in addition to their employment as electrochemical, strain and electrical sensors. It also explains the work done on a range of wearable, flexible sensors, some of the network protocols used to operate them, the current challenges availing in the present scenario and some of the future opportunities in terms of market survey and betterment of the existing sensors.

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Section: Types Of Activity Monitoring With Wearable Flexible Sensorsmentioning

confidence: 99%

Literature Review

Nag¹,

Mukhopadhyay²,

Kosel³

2019

Printed Flexible Sensors

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“…Reliability and flexibility are two key factors for functional e-textiles (Katragadda and Xu 2008) and the electronic chip packaging processes described in this present paper aims to maximize the reliability of the packaged electronic chip whilst, at same time, keeping the package as thin as possible to increase the flexibility of the overall assembly. Different types of substrates, under-fill/adhesive, chip and encapsulation materials have been used to package electronics into the textile.…”

Section: Introductionmentioning

confidence: 99%

Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles

Torah

Liu

et al. 2020

Microsyst Technol

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In this paper a three-dimensional model of a novel electronic package has been developed using Finite element analysis to evaluate the shear load, tensile, bending and thermal stresses. Simulations of a complete flexible flip chip electronic packaging method are performed to minimize stresses on the packaged electronic device to improve robustness and reliability. Three component under-fill adhesives (Loctite 4860, Loctite 480 and Loctite 4902) and three circuit substrate materials (Kapton, Mylar and PEEK) are compared and the optimal thickness of each is found by shear load, tensile load, bending test and thermal expansion simulations. A fixed die size of 3.5 mm 9 8 mm 9 0.53 mm has been simulated and evaluated experimentally under shear and bending load. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. The Kapton substrate together with the Loctite 4902 adhesive were identified as the optimum in the simulation. The simulation of under-fill adhesive and substrate thickness identified an optimum configuration of a 0.045-0.052 mm thick substrate layer and a 0.042-0.045 mm thickness of the Loctite 4902 adhesive. The bending simulation has also been used to determine the neutral axis of the encapsulated electronic package in this paper, thus identifying the optimal material and thickness for the encapsulation layer of the package.

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“…Reliability and flexibility are two key factors for functional e-textiles [6], and the electronic chip packaging processes described in this paper aim to maximize the reliability of the packaged electronic chip while keeping the package as thin as possible to maximize the flexibility of the overall assembly.…”

Section: Introductionmentioning

confidence: 99%

Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

Tudor

Torah

et al. 2018

IEEE Trans. Compon., Packag. Manufact. Technol.

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A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm × 8 mm × 0.53 mm and 2 mm × 2 mm × 0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton, Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.

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A novel intelligent textile technology based on silicon flexible skins

Cited by 16 publications

References 15 publications

Literature Review

Literature Review

Finite element analysis (FEA) modelling and experimental verification to optimise flexible electronic packaging for e-textiles

Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

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